Vendor, Morganville, NJ
Cook and Weil, Inc.
UEI GJMEHZQFN2D9, CAGE 0DW10
6 awards and $293,663 obligated between September 27, 2024 and September 3, 2026, 0% under full and open competition, against 2.2 offers on average where reported. 5 of the awards trace back to a SAM.gov solicitation on this site.
Sells to
Awarding agencies by dollars.
| Department of the Navy | $107,555 |
| National Aeronautics and Space Administration | $99,638 |
| National Institute of Standards and Technology | $86,470 |
Industries
NAICS on the awards, by dollars.
| Semiconductor Machinery ManufacturingNAICS 333242 | $155,315 |
| Semiconductor and Related Device ManufacturingNAICS 334413 | $107,555 |
| Analytical Laboratory Instrument ManufacturingNAICS 334516 | $30,793 |
How it wins
Awards by competition, set-aside and type.
| Not Competed Under SAP | 3 |
| Competed Under SAP | 2 |
| Not Competed | 1 |
| Small Business Set Aside - Total | 2 |
| Purchase Order | 6 |
Hear when Cook and Weil, Inc. wins an award and when a contract it holds is about to end.Follow it
Contracts ending soon
Contracts Cook and Weil, Inc. holds whose performance ends in the next 19 months, by published end date. Each one is a recompete to prepare for.
- Ending
- 1
- Obligated so far
- $40,470
- Soonest
- December 31, 2026
The 1 contract, the office behind each one and the dates are in the workspace. See them
Competes with
Vendors selling semiconductor machinery manufacturing to Department of the Navy, by dollars.
| Honeywell International, Inc.Minneapolis, MN | $48,741,113 |
| Aja International, Inc.Scituate, MA | $1,733,705 |
| Raith America Inc.Hauppauge, NY | $1,511,531 |
| Plasmability LLCAustin, TX | $923,880 |
| Axus Technology LLCChandler, AZ | $549,840 |
| F & K Delvotec Inc.Foothill Ranch, CA | $296,167 |
Solicitations it won
SAM.gov opportunities whose award USAspending attributes to this vendor.
- Semiconductor Die Bonding and Vacuum Packaging System
Department of the Navy, Naval Research Laboratory
Award noticeNAICS 333993Anywhere in the USN0017326P2436Awarded to Cook and Weil, Inc. for $672,985
Posted Sep 15 - Award Notice for Manual Wedge/Ball Wire Bonder
National Institute of Standards and Technology, Department of Commerce NIST
Award noticeSmall businessNAICS 333242Anywhere in the US1333ND25QNB680372Awarded to Cook and Weil, Inc. for $46,000
Posted Sep 24, 20252 publications - TPT Semi-Automatic Heavy Wire Bonder
National Aeronautics and Space Administration, NASA Shared Services Center
Special noticeSmall businessNAICS 333242Anywhere in the US80NSSC25910374QAwarded to Cook and Weil, Inc.
Posted Aug 7, 2025 - Silicon Wafer Ball Bonder
National Aeronautics and Space Administration, NASA Shared Services Center
Special noticeSmall businessNAICS 334516Anywhere in the US80NSSC25909413QAwarded to Cook and Weil, Inc.
Posted Jul 10, 2025 - SEMI-AUTOMATIC THERMSONIC WIRE BONDER
Department of the Navy, Naval Research Laboratory
Combined synopsis and solicitationSmall businessNAICS 334413Anywhere in the USN0017324Q5284Awarded to Cook and Weil, Inc.
Posted Sep 4, 2024
Awards
Every award in the window, by dollars obligated.
| Contract | Awarding office | Described as | Obligated |
|---|---|---|---|
| 80NSSC25PB748Purchase Order, August 14, 2025, Not Competed Under SAP, 1 offersSolicitation | NASA Shared Services CenterNational Aeronautics and Space Administration | TPT Semi-Automatic Heavy Wire BonderNAICS 333242, PSC 6625 | $68,845 |
| N0017324P5284Purchase Order, September 27, 2024, Competed Under SAP, 3 offersSolicitation | Naval Research LaboratoryDepartment of the Navy | Semi-Automatic Thermosonic Wire Bond SystemNAICS 334413, PSC 6640 | $59,595 |
| N0017325P0103Purchase Order, November 7, 2024, Not Competed, 1 offers | Naval Research LaboratoryDepartment of the Navy | TPT Semi-Automatic Thermosonic Wire Bonder PackageNAICS 334413, PSC 3670 | $47,960 |
| 1333ND25PNB680595Purchase Order, September 22, 2025, Competed Under SAP, 6 offersSolicitation | Department of Commerce NISTNational Institute of Standards and Technology | Ou68-25-New-255 Manual Wedge/Ball Wire BonderNAICS 333242, PSC 6640 | $46,000 |
| 1333ND26PNB680428Purchase Order, September 3, 2026, Not Competed Under SAP, 1 offers | Department of Commerce NISTNational Institute of Standards and Technology | Wire Bonder Ou61-Fy26-026-NewNAICS 333242, PSC 6640 | $40,470 |
| 80NSSC25PB486Purchase Order, July 22, 2025, Not Competed Under SAP, 1 offersSolicitation | NASA Shared Services CenterNational Aeronautics and Space Administration | Silicon Wafer Ball BonderNAICS 334516, PSC 6640 | $30,793 |
- Places of performance
- OhioDistrict of ColumbiaNew Jersey
- Product and service codes
- 6640 Laboratory Equipment and Supplies6625 Electrical and Electronic Properties Measuring and Testing Instruments3670 Specialized Semiconductor, Microcircuit, and Printed Circuit Board Manufacturing Machinery
- Transactions
- 6 across 6 awards