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Award notice

Semiconductor Die Bonding and Vacuum Packaging System

N0017326P2436

Department of the Navy, Naval Research Laboratory. Packaging Machinery Manufacturing.

View on SAM.gov Markdown

Awarded

Cook and Weil, Inc.

$672,985.00 on the award notice, September 14, 2026, contract N0017326P2436

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Description

As published on SAM.gov.

This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System.

Publications

Every notice SAM.gov issued under this solicitation number, oldest first. Each is a separate record on SAM.

  1. September 16, 2026

    Award notice

    Awarded to Cook and Weil, Inc. for $672,985. SAM.gov, notice 68c5094fd20d471388d9a1346950e9f7

    1 revisions on SAM
    • September 16, 2026: publish, award notice

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