Award notice
Semiconductor Die Bonding and Vacuum Packaging System
N0017326P2436
Department of the Navy, Naval Research Laboratory. Packaging Machinery Manufacturing.
Awarded
COOK AND WEIL, Inc. Morganville
$672,985.00 on the award notice, September 14, 2026, contract N0017326P2436
Description
As published on SAM.gov.
This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System.
Publications
Every notice SAM.gov issued under this solicitation number, oldest first. Each is a separate record on SAM.
September 15, 2026
Award notice
Awarded to COOK AND WEIL, Inc. Morganville for $672,985. SAM.gov, notice 68c5094fd20d471388d9a1346950e9f7
Points of contact
- KEVIN NGUYENkevin.nguyen3.civ@us.navy.mil
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