# Semiconductor Die Bonding and Vacuum Packaging System

Canonical: https://abierto.us/opportunities/n0017326p2436

- Solicitation number: N0017326P2436
- Notice type: Award notice
- Status: Awarded to COOK AND WEIL, Inc. Morganville for $672,985.00
- Department: Department of the Navy
- Agency: Department of the Navy
- Contracting office: Naval Research Laboratory (N00173)
- NAICS: 333993 Packaging Machinery Manufacturing
- Product or service code: 3540 Wrapping and Packaging Machinery
- Place of performance: Washington, District of Columbia
- First posted: September 15, 2026
- Last posted: September 15, 2026
- SAM.gov: https://sam.gov/workspace/contract/opp/68c5094fd20d471388d9a1346950e9f7/view

## Description

This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System.

## Publications

- September 15, 2026: Award notice. Notice 68c5094fd20d471388d9a1346950e9f7. https://sam.gov/workspace/contract/opp/68c5094fd20d471388d9a1346950e9f7/view

## Points of contact

- KEVIN NGUYEN, kevin.nguyen3.civ@us.navy.mil

---
Source: SAM.gov Contract Opportunities bulk extract. Confirm deadlines on SAM.gov before responding. Cite https://abierto.us/opportunities/n0017326p2436.