Skip to content
Abierto
Menu

Special notice, total small business set-aside

Silicon Wafer Ball Bonder

80NSSC25909413Q

National Aeronautics and Space Administration, NASA Shared Services Center. Analytical Laboratory Instrument Manufacturing.

View on SAM.govMarkdown

Awarded

Cook and Weil, Inc.

$30,793.20 obligated so far on USAspending

Description

As published on SAM.gov.

NASA/NSSC has a requirement for a Silicon Wafer Ball Bonder. See the attached SOW and capability statement for further details.

The contract, on USAspending

Federal procurement data the awarding office reported to FPDS, matched to this solicitation by its number.

Recipient
Cook and Weil, Inc.
UEI
GJMEHZQFN2D9
CAGE
0DW10
Vendor location
Morganville, NJ
Contract
80NSSC25PB486, purchase order
Obligated
$30,793.20
Actions
1 between July 22, 2025 and July 22, 2025
Competition
Not Competed Under SAP, 1 offer received
Set-aside reported
No Set Aside Used.
Described as
Silicon Wafer Ball Bonder
Match
solicitation number 80NSSC25909413Q equals the FPDS solicitation identifier; same awarding office 80NSSC (high confidence)
Record
USAspending award page

Publications

Every notice SAM.gov issued under this solicitation number, oldest first. Each is a separate record on SAM.

  1. July 10, 2025

    Special notice

    Due July 15, 2025 at 5:00 PM EDT. SAM.gov, notice 83e98779dd6b46229d2ef5328ff17a9b

Points of contact

Also open from this buyer