# Silicon Wafer Ball Bonder

Canonical: https://abierto.us/opportunities/80nssc25909413q

- Solicitation number: 80NSSC25909413Q
- Notice type: Special notice
- Status: Awarded to Cook and Weil, Inc.
- Department: National Aeronautics and Space Administration
- Contracting office: NASA Shared Services Center (80NSSC)
- NAICS: 334516 Analytical Laboratory Instrument Manufacturing
- Product or service code: 6640 Laboratory Equipment and Supplies
- Set-aside: Total small business set-aside
- Place of performance: Huntsville, Alabama
- City: Huntsville. https://abierto.us/cities/huntsville-al-0137000
- First posted: July 10, 2025
- Last posted: July 10, 2025
- SAM.gov: https://sam.gov/workspace/contract/opp/83e98779dd6b46229d2ef5328ff17a9b/view

## Description

NASA/NSSC has a requirement for a Silicon Wafer Ball Bonder. See the attached SOW and capability statement for further details.

## Award on USAspending

- Recipient: Cook and Weil, Inc. (UEI GJMEHZQFN2D9)
- Contract: 80NSSC25PB486, purchase order
- Obligated: $30,793.20
- Competition: Not Competed Under SAP, 1 offers received
- Link: solicitation number 80NSSC25909413Q equals the FPDS solicitation identifier; same awarding office 80NSSC (high confidence)
- Record: https://www.usaspending.gov/award/CONT_AWD_80NSSC25PB486_8000_-NONE-_-NONE-/


## Publications

- July 10, 2025: Special notice, due July 15, 2025 at 5:00 PM EDT. Notice 83e98779dd6b46229d2ef5328ff17a9b. https://sam.gov/workspace/contract/opp/83e98779dd6b46229d2ef5328ff17a9b/view

## Points of contact

- Lindsey McLellan, lindsey.m.mclellan@nasa.gov

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Source: SAM.gov Contract Opportunities bulk extract and USAspending.gov award data. Confirm deadlines on SAM.gov before responding. Cite https://abierto.us/opportunities/80nssc25909413q.