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Special notice

Silicon Nitride for sensor packaging for high temperature applications

80NSSC26925189Q

National Aeronautics and Space Administration, NASA Shared Services Center. Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology).

127 open like this View on SAM.gov Markdown

Awarded

Sienna Technologies, Inc.

$136,040.00 obligated so far on USAspending

Get the next one like this from National Aeronautics and Space Administration by email, the day it is posted.Find my opportunities

This one was awarded in 2026

127 like it are open now in research and development in the physical, engineering, and life sciences (except nanotechnology and biotechnology)

All 127 open in research and development in the physical, engineering, and life sciences (except nanotechnology and biotechnology)

Description

As published on SAM.gov.


All correspondence should reference Notice ID 80NSSC26925189Q in the subject line.

Synopsis:

NASA/NSSC has a requirement for Silicon Nitride for sensor packaging for high temperature applications. 

NASA/NSSC intends to issue a sole source contract to SIENNA TECHNOLOGIES, INC. 11611 49TH PL W Mukilteo, Washington 98275 United States under the authority of FAR 13.106-1(b)(1)(i). It has been determined that SIENNA TECHNOLOGIES, INC. is the sole provider of Silicon Nitride for sensor packaging for high temperature applications

NASA/NSSC will be the procuring center for this effort.  Performance will be located at NASA/ Glenn Research Center (GRC).

The Government intends to acquire commercial items and services using the provisions, clauses and procedures prescribed in FAR Part 12 and FAR Part 13.

The NAICS Code for this procurement is 541715.

Interested organizations may submit their capabilities and qualifications to perform the effort in writing to the identified point of contact not later than 4:00 p.m. Central Standard Time on 2/25/2026. Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this procurement on a competitive basis. A determination by the Government not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the government.

Oral communications are not acceptable in response to this notice.

NASA Clause 1852.215-84, Ombudsman, is applicable. The Center Ombudsman for this acquisition can be found at http://prod.nais.nasa.gov/pub/pub_library/Omb.html .

Primary Point of Contact:

Laura Quave

Procurement Specialist

laura.a.quave@nasa.gov

228-813-6420

Attachments

Files listed on SAM.gov. The ones we hold a copy of download from here; the rest open SAM's download, which needs no account.

The contract, on USAspending

Federal procurement data the awarding office reported to FPDS, matched to this solicitation by its number.

Recipient
Sienna Technologies, Inc.
UEI
W8VZALJ8J617
CAGE
084Z5
Vendor location
Mukilteo, WA
Contract
80NSSC26P0287, purchase order
Obligated
$136,040.00
Actions
2 between February 27, 2026 and July 31, 2026
Competition
Not Competed Under SAP, 1 offer received
Set-aside reported
No Set Aside Used.
Described as
Silicon Nitride for Sensor Packaging for High Temperature Applications
Match
solicitation number 80NSSC26925189Q equals the FPDS solicitation identifier; same awarding office 80NSSC (high confidence)
Record
USAspending award page

Publications

Every notice SAM.gov issued under this solicitation number, oldest first. Each is a separate record on SAM.

  1. February 23, 2026

    Special notice

    Due February 25, 2026 at 5:00 PM EST. SAM.gov, notice 813bbdb80a154651aeafa08be1641b83

    1 revisions on SAM
    • February 23, 2026: publish, special notice

Points of contact