Vendor, Mukilteo, WA

Sienna Technologies, Inc.

UEI W8VZALJ8J617, CAGE 084Z5

4 awards and $249,268 obligated between January 30, 2026 and July 31, 2026, 0% under full and open competition, against 1.3 offers on average where reported. 2 of the awards trace back to a SAM.gov solicitation on this site.

On USAspending Markdown

Sells to

Awarding agencies by dollars.

National Aeronautics and Space Administration	$196,040
Department of the Navy	$53,228

Industries

NAICS on the awards, by dollars.

Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)NAICS 541715	$136,040
Other Electronic Component ManufacturingNAICS 334419	$60,000
Radio and Television Broadcasting and Wireless Communications Equipment ManufacturingNAICS 334220	$53,228

How it wins

Awards by competition, set-aside and type.

Not Competed Under SAP	2
Competed Under SAP	2
Purchase Order	4

Solicitations it won

SAM.gov opportunities whose award USAspending attributes to this vendor.

Multichip Module Package for SiC Pressure Sensors
National Aeronautics and Space Administration, NASA Shared Services Center
Combined synopsis and solicitationNAICS 334419Ohio80NSSC26936730Q
Awarded to Sienna Technologies, Inc.
Posted Jun 26
Silicon Nitride for sensor packaging for high temperature applications
National Aeronautics and Space Administration, NASA Shared Services Center
Special noticeNAICS 54171580NSSC26925189Q
Awarded to Sienna Technologies, Inc.
Posted Feb 23

Awards

Every award in the window, by dollars obligated.

Contract	Awarding office	Described as	Obligated
80NSSC26P0287Purchase Order, February 27, 2026, Not Competed Under SAP, 1 offersSolicitation	NASA Shared Services CenterNational Aeronautics and Space Administration	Silicon Nitride for Sensor Packaging for High Temperature ApplicationsNAICS 541715, PSC R425	$136,040
80NSSC26P0915Purchase Order, June 30, 2026, Not Competed Under SAP, 1 offersSolicitation	NASA Shared Services CenterNational Aeronautics and Space Administration	80nssc24pc199 Multichip Module Package for Sic Pressure SensorsNAICS 334419, PSC 6695	$60,000
N0017826P6639Purchase Order, January 30, 2026, Competed Under SAP, 2 offers	NSWC DahlgrenDepartment of the Navy	1003-02 - AttenuatorsNAICS 334220, PSC 5985	$53,228
80NSSC24PC199Purchase Order, July 31, 2026, Competed Under SAP, 1 offers	NASA Shared Services CenterNational Aeronautics and Space Administration	Multi-Chip Module Packaging of Sic Pressure Sensors and ElectronicsNAICS 334419, PSC H299	$0

Places of performance: Washington
Product and service codes: R425 Engineering and Technical Services 6695 Combination and Miscellaneous Instruments 5985 Antennas, Waveguide, and Related Equipment H299 Equipment and Materials Testing: Miscellaneous
Transactions: 7 across 4 awards