Vendor, Mukilteo, WA
Sienna Technologies, Inc.
UEI W8VZALJ8J617, CAGE 084Z5
7 awards and $602,268 obligated between February 6, 2024 and July 31, 2026, 0% under full and open competition, against 1.1 offers on average where reported. 5 of the awards trace back to a SAM.gov solicitation on this site.
Sells to
Awarding agencies by dollars.
| National Aeronautics and Space Administration | $549,040 |
| Department of the Navy | $53,228 |
Industries
NAICS on the awards, by dollars.
| Other Electronic Component ManufacturingNAICS 334419 | $269,250 |
| All Other Miscellaneous Electrical Equipment and Component ManufacturingNAICS 335999 | $143,750 |
| Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)NAICS 541715 | $136,040 |
| Radio and Television Broadcasting and Wireless Communications Equipment ManufacturingNAICS 334220 | $53,228 |
How it wins
Awards by competition, set-aside and type.
| Not Competed Under SAP | 4 |
| Competed Under SAP | 2 |
| Not Competed | 1 |
| Purchase Order | 7 |
Hear when Sienna Technologies, Inc. wins an award and when a contract it holds is about to end.Follow it
Contracts ending soon
Contracts Sienna Technologies, Inc. holds whose performance ends in the next 19 months, by published end date. Each one is a recompete to prepare for.
- Ending
- 2
- Obligated so far
- $125,500
- Soonest
- November 18, 2026
The 2 contracts, the office behind each one and the dates are in the workspace. See them
Competes with
Vendors selling other electronic component manufacturing to National Aeronautics and Space Administration, by dollars.
| Crane Electronics Inc.Lynnwood, WA | $351,883 |
| Motorcar Parts of America, Inc.Torrance, CA | $320,600 |
| Laserline, Inc.Santa Clara, CA | $233,750 |
| Ganify, Inc.Santa Barbara, CA | $150,000 |
| Cable Specialties, Inc.Fort Myers, FL | $94,392 |
| Mach 33 Engineering LLCBeltsville, MD | $92,585 |
Solicitations it won
SAM.gov opportunities whose award USAspending attributes to this vendor.
- Multichip Module Package for SiC Pressure Sensors
National Aeronautics and Space Administration, NASA Shared Services Center
Combined synopsis and solicitationNAICS 334419Anywhere in the US80NSSC26936730QAwarded to Sienna Technologies, Inc.
Posted Jun 26 - Silicon Nitride for sensor packaging for high temperature applications
National Aeronautics and Space Administration, NASA Shared Services Center
Special noticeNAICS 541715Anywhere in the US80NSSC26925189QAwarded to Sienna Technologies, Inc.
Posted Feb 23 - Multi-Chip Module Packaging of SiC Pressure Sensors and Electronics
National Aeronautics and Space Administration, NASA Shared Services Center
Special noticeNAICS 334419Cleveland, OH80NSSC24881222QAwarded to Sienna Technologies, Inc.
Posted Aug 20, 2024 - DRPA Sensor Chips
National Aeronautics and Space Administration, NASA Shared Services Center
Special noticeNAICS 334419Anywhere in the US80NSSC24871577QAwarded to Sienna Technologies, Inc.
Posted Jun 5, 2024 - HF2C SiC Pressure-Temperature Sensors Packaging
National Aeronautics and Space Administration, NASA Shared Services Center
Special noticeNAICS 335999Anywhere in the US80NSSC24860776QAwarded to Sienna Technologies, Inc.
Posted Jan 29, 2024
Awards
Every award in the window, by dollars obligated.
| Contract | Awarding office | Described as | Obligated |
|---|---|---|---|
| 80NSSC24PA494Purchase Order, February 6, 2024, Not Competed Under SAP, 1 offersSolicitation | NASA Shared Services CenterNational Aeronautics and Space Administration | HF2C Sic Pressure-Temperature Sensors PackagingNAICS 335999, PSC 6695 | $143,750 |
| 80NSSC24PB522Purchase Order, June 11, 2024, Not Competed Under SAP, 1 offersSolicitation | NASA Shared Services CenterNational Aeronautics and Space Administration | Drpa Sensor ChipsNAICS 334419, PSC 9390 | $143,750 |
| 80NSSC26P0287Purchase Order, February 27, 2026, Not Competed Under SAP, 1 offersSolicitation | NASA Shared Services CenterNational Aeronautics and Space Administration | Silicon Nitride for Sensor Packaging for High Temperature ApplicationsNAICS 541715, PSC R425 | $136,040 |
| 80NSSC24PC199Purchase Order, August 26, 2024, Competed Under SAP, 1 offersSolicitation | NASA Shared Services CenterNational Aeronautics and Space Administration | Multi-Chip Module Packaging of Sic Pressure Sensors and ElectronicsNAICS 334419, PSC H299 | $65,500 |
| 80NSSC26P0915Purchase Order, June 30, 2026, Not Competed Under SAP, 1 offersSolicitation | NASA Shared Services CenterNational Aeronautics and Space Administration | 80nssc24pc199 Multichip Module Package for Sic Pressure SensorsNAICS 334419, PSC 6695 | $60,000 |
| N0017826P6639Purchase Order, January 30, 2026, Competed Under SAP, 2 offers | NSWC DahlgrenDepartment of the Navy | 1003-02 - AttenuatorsNAICS 334220, PSC 5985 | $53,228 |
| 80NSSC22PA410Purchase Order, September 11, 2024, Not Competed, 1 offers | NASA Shared Services CenterNational Aeronautics and Space Administration | Packaging of ON-CHIP Integrated Silicon Carbide Pressure and Micro-Tc SensorsNAICS 541715, PSC 9390 | $0 |
- Places of performance
- Washington
- Product and service codes
- 6695 Combination and Miscellaneous Instruments9390 Miscellaneous Fabricated Nonmetallic MaterialsR425 Engineering and Technical ServicesH299 Equipment and Materials Testing: Miscellaneous5985 Antennas, Waveguide, and Related Equipment
- Transactions
- 21 across 7 awards