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Combined synopsis and solicitation

Multichip Module Package for SiC Pressure Sensors

80NSSC26936730Q

National Aeronautics and Space Administration, NASA Shared Services Center. Other Electronic Component Manufacturing.

103 open like this View on SAM.gov Markdown

Awarded

Sienna Technologies, Inc.

$60,000.00 obligated so far on USAspending

Get the next one like this from National Aeronautics and Space Administration by email, the day it is posted.Find my opportunities

This one was awarded in 2026

103 like it are open now in other electronic component manufacturing

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Description

As published on SAM.gov.

** THIS IS A SOLE SOURCE REQUIREMENT ** for Multichip Module Package for SiC Pressure Sensors

Attachments

Files listed on SAM.gov. The ones we hold a copy of download from here; the rest open SAM's download, which needs no account.

The contract, on USAspending

Federal procurement data the awarding office reported to FPDS, matched to this solicitation by its number.

Recipient
Sienna Technologies, Inc.
UEI
W8VZALJ8J617
CAGE
084Z5
Vendor location
Mukilteo, WA
Contract
80NSSC26P0915, purchase order
Obligated
$60,000.00
Actions
2 between June 30, 2026 and July 30, 2026
Competition
Not Competed Under SAP, 1 offer received
Set-aside reported
No Set Aside Used.
Described as
80nssc24pc199 Multichip Module Package for Sic Pressure Sensors
Match
solicitation number 80NSSC26936730Q equals the FPDS solicitation identifier; same awarding office 80NSSC (high confidence)
Record
USAspending award page

Publications

Every notice SAM.gov issued under this solicitation number, oldest first. Each is a separate record on SAM.

  1. June 26, 2026

    Combined synopsis and solicitation

    Due June 30, 2026 at 8:00 AM EDT. SAM.gov, notice be8e1f1156144652a73c065ffad6e328

    1 revisions on SAM
    • June 26, 2026: publish, combined synopsis and solicitation

Points of contact