# Sienna Technologies, Inc.

Canonical: https://abierto.us/vendors/sienna-technologies-inc-w8vzalj8j617

- UEI: W8VZALJ8J617
- CAGE: 084Z5
- Location: Mukilteo, WA
- Awards in window: 7 (21 transactions), $602,268 obligated, February 6, 2024 to July 31, 2026

## Awarding agencies

- National Aeronautics and Space Administration: 6 awards, $549,040
- Department of the Navy: 1 awards, $53,228

## Industries

- 334419 Other Electronic Component Manufacturing: $269,250
- 335999 All Other Miscellaneous Electrical Equipment and Component Manufacturing: $143,750
- 541715 Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology): $136,040
- 334220 Radio and Television Broadcasting and Wireless Communications Equipment Manufacturing: $53,228

## Competition

- Not Competed Under SAP: 4 awards
- Competed Under SAP: 2 awards
- Not Competed: 1 awards

## Solicitations won

- Multichip Module Package for SiC Pressure Sensors (80NSSC26936730Q). https://abierto.us/opportunities/80nssc26936730q
- Silicon Nitride for sensor packaging for high temperature applications (80NSSC26925189Q). https://abierto.us/opportunities/80nssc26925189q
- Multi-Chip Module Packaging of SiC Pressure Sensors and Electronics (80NSSC24881222Q). https://abierto.us/opportunities/80nssc24881222q
- DRPA Sensor Chips (80NSSC24871577Q). https://abierto.us/opportunities/80nssc24871577q
- HF2C SiC Pressure-Temperature Sensors Packaging (80NSSC24860776Q). https://abierto.us/opportunities/80nssc24860776q

## Largest awards

- 80NSSC24PA494 (purchase order): $143,750, NASA Shared Services Center. HF2C Sic Pressure-Temperature Sensors Packaging. https://www.usaspending.gov/award/CONT_AWD_80NSSC24PA494_8000_-NONE-_-NONE-/
- 80NSSC24PB522 (purchase order): $143,750, NASA Shared Services Center. Drpa Sensor Chips. https://www.usaspending.gov/award/CONT_AWD_80NSSC24PB522_8000_-NONE-_-NONE-/
- 80NSSC26P0287 (purchase order): $136,040, NASA Shared Services Center. Silicon Nitride for Sensor Packaging for High Temperature Applications. https://www.usaspending.gov/award/CONT_AWD_80NSSC26P0287_8000_-NONE-_-NONE-/
- 80NSSC24PC199 (purchase order): $65,500, NASA Shared Services Center. Multi-Chip Module Packaging of Sic Pressure Sensors and Electronics. https://www.usaspending.gov/award/CONT_AWD_80NSSC24PC199_8000_-NONE-_-NONE-/
- 80NSSC26P0915 (purchase order): $60,000, NASA Shared Services Center. 80nssc24pc199 Multichip Module Package for Sic Pressure Sensors. https://www.usaspending.gov/award/CONT_AWD_80NSSC26P0915_8000_-NONE-_-NONE-/
- N0017826P6639 (purchase order): $53,228, NSWC Dahlgren. 1003-02 - Attenuators. https://www.usaspending.gov/award/CONT_AWD_N0017826P6639_9700_-NONE-_-NONE-/
- 80NSSC22PA410 (purchase order): $0, NASA Shared Services Center. Packaging of ON-CHIP Integrated Silicon Carbide Pressure and Micro-Tc Sensors. https://www.usaspending.gov/award/CONT_AWD_80NSSC22PA410_8000_-NONE-_-NONE-/

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Source: USAspending.gov award data, keyed by UEI. Obligations in the window only. Cite https://abierto.us/vendors/sienna-technologies-inc-w8vzalj8j617.