Combined synopsis and solicitation

Die Bonding and Vacuum Packaging System

N0017326QKN05

Department of the Navy, Naval Research Laboratory. Packaging Machinery Manufacturing.

Awarded

$176,046.08 obligated so far on USAspending

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Description

As published on SAM.gov.

Please see attached combined synopsis/solicitation

Files listed on SAM.gov. The ones we hold a copy of download from here; the rest open SAM's download, which needs no account.

Federal procurement data the awarding office reported to FPDS, matched to this solicitation by its number.

Recipient: Carahsoft Technology Corp.
UEI: DT8KJHZXVJH5
CAGE: 1P3C5
Vendor location: Reston, VA
Contract: N0017326F2411 under N6600124A0034, bpa call
Obligated: $176,046.08
Actions: 1 between May 14, 2026 and May 14, 2026
Competition: Full and Open Competition
Described as: 1. This Action Is a Call Order Issued Pursuant to the Terms and Conditions Included in the BPA N66001-24-A-0034. 2. Quotation # 64039215, Dated 04/06/2026, Is Incorporated by Reference
Match: solicitation number N0017326QKN05 equals the FPDS solicitation identifier; same awarding office N00173 (high confidence)
Record: USAspending award page

Every notice SAM.gov issued under this solicitation number, oldest first. Each is a separate record on SAM.