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Award notice

Award Notice: Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture

1333ND26CNB030008

National Institute of Standards and Technology, Department of Commerce NIST. Research and Development in Nanotechnology.

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Awarded

Auburn University

$1,000,000.00 on the award notice, April 28, 2026, contract 1333ND26CNB030008

Description

As published on SAM.gov.

The contract action was fixed-price and non-competitive because only one responsible source and no other supplies or services will satisfy agency requirements.

The contract, on USAspending

Federal procurement data the awarding office reported to FPDS, matched to this solicitation by its number.

Recipient
Auburn University
UEI
DMQNDJDHTDG4
CAGE
8H404
Vendor location
Auburn, AL
Contract
1333ND26CNB030008, definitive contract
Obligated
$1,000,000.00
Actions
1 between April 28, 2026 and April 28, 2026
Competition
Not Competed, 1 offer received
Set-aside reported
No Set Aside Used.
Described as
Ou03-Fy26-181-New Micro Specimens of Electroplated Copper and Micro-Sized Lead-Free Solder for Mechanical Testing to Fracture.
Match
award number 1333ND26CNB030008 equals the contract number; same awarding office 1333ND (high confidence)
Record
USAspending award page

Publications

Every notice SAM.gov issued under this solicitation number, oldest first. Each is a separate record on SAM.

  1. May 20, 2026

    Award notice

    Awarded to AUBURN UNIVERSITY Auburn for $1,000,000. SAM.gov, notice 185b21d55a704737a208741e07ccbb4a

Points of contact

Also open from this buyer