Vendor, Santa Clara, CA
Silitronics Solutions Inc.
UEI PXA1DLAKG1F7, CAGE 9G0X1
1 award and $59,485 obligated between August 13, 2026 and August 13, 2026, 0% under full and open competition, against 1.0 offers on average where reported. 1 of the awards trace back to a SAM.gov solicitation on this site.
How it wins
Awards by competition, set-aside and type.
| Not Competed Under SAP | 1 |
| Purchase Order | 1 |
Solicitations it won
SAM.gov opportunities whose award USAspending attributes to this vendor.
- Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.
National Aeronautics and Space Administration, NASA Shared Services Center
Special noticeNAICS 81392080NSSC26939631QAwarded to Silitronics Solutions Inc.
Posted Aug 10
Awards
Every award in the window, by dollars obligated.
| Contract | Awarding office | Described as | Obligated |
|---|---|---|---|
| 80NSSC26P1297Purchase Order, August 13, 2026, Not Competed Under SAP, 1 offersSolicitation | NASA Shared Services CenterNational Aeronautics and Space Administration | Photonic Integrated Circuit Packaging Service for 8 Pics. Includes Wore Bonding to Pcb, Fiber Alignment and Bonding of Faus and Associated PNAICS 813920, PSC R609 | $59,485 |
- Places of performance
- California
- Product and service codes
- R609 Stenographic Services
- Transactions
- 1 across 1 awards