Vendor, Santa Clara, CA
Silitronics Solutions Inc.
UEI PXA1DLAKG1F7, CAGE 9G0X1
2 awards and $80,905 obligated between July 21, 2025 and August 13, 2026, 0% under full and open competition, against 1.0 offers on average where reported. 1 of the awards trace back to a SAM.gov solicitation on this site.
Industries
NAICS on the awards, by dollars.
| Professional OrganizationsNAICS 813920 | $59,485 |
| All Other Business Support ServicesNAICS 561499 | $21,420 |
How it wins
Awards by competition, set-aside and type.
| Not Competed Under SAP | 2 |
| Purchase Order | 2 |
Hear when Silitronics Solutions Inc. wins an award and when a contract it holds is about to end.Follow it
Contracts ending soon
None of Silitronics Solutions Inc.'s contracts with a published end date ends in the next 19 months.
Competes with
Vendors selling professional organizations to National Aeronautics and Space Administration, by dollars.
| Organisation for Economic Cooperation and DevelopmentWashington, DC | $268,049 |
| World 50, LLCAtlanta, GA | $224,000 |
| American Astronautical Society Inc.Springfield, VA | $207,900 |
| American Society for Testing & MaterialsWashington, DC | $196,000 |
| Interacademy Partnership, Inc.Washington, DC | $84,000 |
| Open Assembly, Inc.Broomfield, CO | $75,000 |
Solicitations it won
SAM.gov opportunities whose award USAspending attributes to this vendor.
- Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.
National Aeronautics and Space Administration, NASA Shared Services Center
Special noticeNAICS 813920Anywhere in the US80NSSC26939631QAwarded to Silitronics Solutions Inc.
Posted Aug 10
Awards
Every award in the window, by dollars obligated.
| Contract | Awarding office | Described as | Obligated |
|---|---|---|---|
| 80NSSC26P1297Purchase Order, August 13, 2026, Not Competed Under SAP, 1 offersSolicitation | NASA Shared Services CenterNational Aeronautics and Space Administration | Photonic Integrated Circuit Packaging Service for 8 Pics. Includes Wore Bonding to Pcb, Fiber Alignment and Bonding of Faus and Associated PNAICS 813920, PSC R609 | $59,485 |
| 80NSSC25PB503Purchase Order, July 21, 2025, Not Competed Under SAP, 1 offers | NASA Shared Services CenterNational Aeronautics and Space Administration | Perform Fiber Alignment and Bonding of Fiber Array Units (Faus) and Photonic Integrated Circuits (Pics).NAICS 561499, PSC R499 | $21,420 |
- Places of performance
- California
- Product and service codes
- R609 Stenographic ServicesR499 Other Professional Services
- Transactions
- 3 across 2 awards