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Special notice

Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.

80NSSC26939631Q

National Aeronautics and Space Administration, NASA Shared Services Center. Professional Organizations.

2 open like this View on SAM.gov Markdown

Awarded

Silitronics Solutions Inc.

$59,484.58 obligated so far on USAspending

Get the next one like this from National Aeronautics and Space Administration by email, the day it is posted.Find my opportunities

This one was awarded in 2026

2 like it are open now in professional organizations

Description

As published on SAM.gov.

NASA/NSSC has a requirement for Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs. 


NASA/NSSC intends to issue a sole source contract to silitronics solutions inc under the authority of FAR 12.102(a). It has been determined that silitronics solutions inc 2388 walsh ave Santa Clara California 95051 – 1301 United States is the sole provider of Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.


NASA/NSSC will be the procuring center for this effort. Performance will be located at NASA/ Ames Research Center (ARC).
The Government intends to acquire Commercial items or services using the provisions, clauses and procedures prescribed in FAR Part 12 for Commercial


The NAICS Code for this procurement is 813920.


Interested organizations may submit their capabilities and qualifications to perform the effort in writing to the identified point of contact not later than 3:00 p.m. Central Standard Time on 8/12/2026. Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this procurement on a competitive basis. A determination by the Government not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the government. Oral communications are not acceptable in response to this notice. NASA FAR Supplement Clause 1852.215-84, Ombudsman, is applicable.

The Center Ombudsman for this acquisition can be found at https://www.hq.nasa.gov/office/procurement/regs/Procurement-Ombuds-Comp-Advocate-Listing.pdf . Primary Point of Contact: Kacey.l.hickman@nasa.gov

Attachments

Files listed on SAM.gov. The ones we hold a copy of download from here; the rest open SAM's download, which needs no account.

The contract, on USAspending

Federal procurement data the awarding office reported to FPDS, matched to this solicitation by its number.

Recipient
Silitronics Solutions Inc.
UEI
PXA1DLAKG1F7
CAGE
9G0X1
Vendor location
Santa Clara, CA
Contract
80NSSC26P1297, purchase order
Obligated
$59,484.58
Actions
1 between August 13, 2026 and August 13, 2026
Competition
Not Competed Under SAP, 1 offer received
Set-aside reported
No Set Aside Used.
Described as
Photonic Integrated Circuit Packaging Service for 8 Pics. Includes Wore Bonding to Pcb, Fiber Alignment and Bonding of Faus and Associated Process Development and Engineering Costs.
Match
solicitation number 80NSSC26939631Q equals the FPDS solicitation identifier; same awarding office 80NSSC (high confidence)
Record
USAspending award page

Publications

Every notice SAM.gov issued under this solicitation number, oldest first. Each is a separate record on SAM.

  1. August 10, 2026

    Special notice

    Due August 12, 2026 at 4:00 PM EDT. SAM.gov, notice 9517449fa10b4afd8b72b245d5a29ed8

    1 revisions on SAM
    • August 10, 2026: publish, special notice

Points of contact