Vendor, Mesa, AZ
Finetech
UEI DL8LPYERW429, CAGE 1YMD5
1 award and $628,110 obligated between January 29, 2025 and July 20, 2026, 0% under full and open competition, against 4.0 offers on average where reported. 6 of the awards trace back to a SAM.gov solicitation on this site.
Industries
NAICS on the awards, by dollars.
| Semiconductor and Related Device ManufacturingNAICS 334413 | $628,110 |
How it wins
Awards by competition, set-aside and type.
| Competed Under SAP | 1 |
| Purchase Order | 1 |
Hear when Finetech wins an award and when a contract it holds is about to end.Follow it
Contracts ending soon
None of Finetech's contracts with a published end date ends in the next 19 months.
Competes with
Vendors selling semiconductor and related device manufacturing to National Institute of Standards and Technology, by dollars.
| Sigray, Inc.Benicia, CA | $2,050,999 |
| Formfactor, Inc.Livermore, CA | $1,244,932 |
| Dectris USA Inc.Philadelphia, PA | $1,087,900 |
| Mpi America Inc.San Jose, CA | $1,068,264 |
| Veeco Process Equipment Inc.Saint Paul, MN | $748,840 |
| Primenano, Inc.Santa Clara, CA | $471,250 |
Solicitations it won
SAM.gov opportunities whose award USAspending attributes to this vendor.
- Automated High Placement Accuracy Flip-Chip Die Bonder
National Institute of Standards and Technology, Department of Commerce NIST
Award noticeSmall businessNAICS 334413Anywhere in the US1333ND24QNB030528Awarded to Finetech for $643,110
Posted Jan 30, 20256 publications
Awards
Every award in the window, by dollars obligated.
| Contract | Awarding office | Described as | Obligated |
|---|---|---|---|
| 1333ND25PNB030043Purchase Order, January 29, 2025, Competed Under SAP, 4 offersSolicitation | Department of Commerce NISTNational Institute of Standards and Technology | Purchase of Automated Die Bonder and Extended WarrantyNAICS 334413, PSC 5961 | $628,110 |
- Places of performance
- Arizona
- Product and service codes
- 5961 Semiconductor Devices and Associated Hardware
- Transactions
- 3 across 1 awards