# Finetech

Canonical: https://abierto.us/vendors/finetech-dl8lpyerw429

- UEI: DL8LPYERW429
- CAGE: 1YMD5
- Location: Mesa, AZ
- Awards in window: 1 (3 transactions), $628,110 obligated, January 29, 2025 to July 20, 2026

## Awarding agencies

- National Institute of Standards and Technology: 1 awards, $628,110

## Industries

- 334413 Semiconductor and Related Device Manufacturing: $628,110

## Competition

- Competed Under SAP: 1 awards

## Solicitations won

- Automated High Placement Accuracy Flip-Chip Die Bonder (1333ND24QNB030528), $643,110. https://abierto.us/opportunities/1333nd24qnb030528

## Largest awards

- 1333ND25PNB030043 (purchase order): $628,110, Department of Commerce NIST. Purchase of Automated Die Bonder and Extended Warranty. https://www.usaspending.gov/award/CONT_AWD_1333ND25PNB030043_1341_-NONE-_-NONE-/

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Source: USAspending.gov award data, keyed by UEI. Obligations in the window only. Cite https://abierto.us/vendors/finetech-dl8lpyerw429.