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Special notice

Multi-Chip Module Packaging of SiC Pressure Sensors and Electronics

80NSSC24881222Q

National Aeronautics and Space Administration, NASA Shared Services Center. Other Electronic Component Manufacturing.

View on SAM.govMarkdown

Awarded

Sienna Technologies, Inc.

$65,500.00 obligated so far on USAspending

Description

As published on SAM.gov.

**SOLE SOURCE REQUIREMENT** FOR Multi-Chip Module Packaging of SiC Pressure Sensors and Electronics

The contract, on USAspending

Federal procurement data the awarding office reported to FPDS, matched to this solicitation by its number.

Recipient
Sienna Technologies, Inc.
UEI
W8VZALJ8J617
CAGE
084Z5
Vendor location
Mukilteo, WA
Contract
80NSSC24PC199, purchase order
Obligated
$65,500.00
Actions
3 between August 26, 2024 and July 31, 2026
Competition
Competed Under SAP, 1 offer received
Set-aside reported
No Set Aside Used.
Described as
Multi-Chip Module Packaging of Sic Pressure Sensors and Electronics
Match
solicitation number 80NSSC24881222Q equals the FPDS solicitation identifier; same awarding office 80NSSC (high confidence)
Record
USAspending award page

Publications

Every notice SAM.gov issued under this solicitation number, oldest first. Each is a separate record on SAM.

  1. August 20, 2024

    Special notice

    Due August 23, 2024 at 10:00 AM EDT. SAM.gov, notice 3c780619f5424a8d89a09358c0ae079b

Points of contact

Also open from this buyer