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Combined synopsis and solicitation, total small business set-aside

Amendment 1 to Automatic Wire Bonder

1333ND26QNB030043

National Institute of Standards and Technology, Department of Commerce NIST. Semiconductor Machinery Manufacturing.

View on SAM.govMarkdown

Awarded

Hesse Mechatronics, Inc.

$168,790.00 obligated so far on USAspending

Description

As published on SAM.gov.

AMENDMENT 1 TO SOLICITATION 1333ND26QNB030043 Due to Vendor Questions:

Vendor Question 1: Can you let me know if the parts will be held on flat boats or manually placed on the workholder?

NIST Response: The samples (chips) need to be wire bonder to a 256-pin ceramic package. This ceramic package needs to be affixed to the stage of the bonder for wire bonding.

Vendor Question 2:

Current Equipment: Are you currently using a manual wire bonder? If so, could you specify the make and model?

NIST Response:

No Vendor Question 3:

Application: What type of bonding applications do you plan to run with the new wire bonder?

NIST Response: We are looking to bond a 1 cm2 chip inside a 256-pin double-tiered ceramic package and streamline the process Vendor Question 4:

Bonding Tools: Are there specific bonding tools or configurations required for your applications?

NIST Response: You will find this information in the Statement of Work.

Vendor Question 5:

Accessories: Will you need additional items such as a microscope, work holders, or any other accessories?

NIST Response: The tool should contain a scope for inspection and a way to fix the sample piece to the stage. As described in the attached Combined Synopsis Solicitation, Statement of Work and Applicable Provisions and Clauses

The contract, on USAspending

Federal procurement data the awarding office reported to FPDS, matched to this solicitation by its number.

Recipient
Hesse Mechatronics, Inc.
UEI
D82USL6K1BJ3
CAGE
63CA4
Vendor location
Irvine, CA
Contract
1333ND26PNB030100, purchase order
Obligated
$168,790.00
Actions
1 between June 16, 2026 and June 16, 2026
Competition
Competed Under SAP, 5 offers received
Set-aside reported
Small Business Set Aside - Total
Described as
Ou03-Fy26-147-New Automatic Wire Bonder
Match
solicitation number 1333ND26QNB030043 equals the FPDS solicitation identifier; same awarding office 1333ND (high confidence)
Record
USAspending award page

Publications

Every notice SAM.gov issued under this solicitation number, oldest first. Each is a separate record on SAM.

  1. March 6, 2026

    Combined synopsis and solicitation

    Automatic Wire Bonder

    Due March 20, 2026 at 12:00 PM EDT. SAM.gov, notice 4ab183cc8a6745239de1d8b767b0ab70

  2. March 6, 2026

    Combined synopsis and solicitation

    Automatic Wire Bonder

    Due March 20, 2026 at 12:00 PM EDT. SAM.gov, notice dc08bfd7b3b2426b8618d8e1a367b68b

  3. March 10, 2026

    Combined synopsis and solicitation

    Due March 20, 2026 at 12:00 PM EDT. SAM.gov, notice d8907ca8da104197b8e498fd0510187f

Points of contact

Also open from this buyer