Vendor, Seattle, WA
Tignis, Inc.
UEI C41GHC9EWMJ8, CAGE 9WQ71
1 award and $99,994 obligated between January 3, 2025 and January 3, 2025, 100% under full and open competition, against 17.0 offers on average where reported.
How it wins
Awards by competition, set-aside and type.
| Full and Open Competition After Exclusion of Sources | 1 |
| Small Business Set Aside - Total | 1 |
| Purchase Order | 1 |
Awards
Every award in the window, by dollars obligated.
| Contract | Awarding office | Described as | Obligated |
|---|---|---|---|
| HQ072725PE003Purchase Order, January 3, 2025, Full and Open Competition After Exclusion of Sources, 17 offers | Defense Microelectronics ActivityDefense Microelectronics Activity | SBIR Phase I -Software Development for Deposition of Thick Sic Epilayers Services to Design, Fabricate, Assemble, Build, Test, Evaluate, VerNAICS 541511, PSC AC11 | $99,994 |
- Places of performance
- Washington
- Product and service codes
- AC11 National Defense R&D Services; Department Of Defense - Military; Basic Research
- Transactions
- 1 across 1 awards