Sources sought
Advanced Uncooled Thermal Integration Efforts
W56KGU-RTI-0426
Department of the Army, W6QK ACC-APG. Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology).
Response deadline
April 26, 2026 at 11:59 AM EDT
Closed 145 days ago. Posted April 1, 2026, first published March 26, 2026. Scheduled to archive May 11, 2026.
Description
As published on SAM.gov.
The United States Army Combat Capabilities Development Command (DEVCOM), Command, Control, Computers, Communications, Cyber, Intelligence, Surveillance and Reconnaissance (C5ISR) Center is performing market research to inform future system level requirements and/or prototype development/build efforts which integrate next generation uncooled thermal sensors. The desired systems shall incorporate Government Furnished Equipment (GFE) thermal sensors.
These thermal sensors will be compliant with a TBD Interface Control Document and will be lens-less. The system integrators will need to design an appropriate lens for the application that will interface with the sensors to demonstrate the advanced capability and prove out Technology Readiness Level (TRL) 6+ by being assessed in a relevant environment. Responses including complete systems and/or individual capabilities/expertise listed below are welcome. Proposed systems should focus on showcasing these advanced sensors in systems that are optimized for low Size, Weight, and Power and Cost (SWaP-C).
Publications
Every notice SAM.gov issued under this solicitation number, oldest first. Each is a separate record on SAM.
Points of contact
- Christina Sanchezchristina.m.sanchez47.civ@army.mil
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