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Award notice, first published as justification

Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays

W56KGU26CA004

Department of the Army, W6QK ACC-APG.

View on SAM.govMarkdown

Awarded

DRS Network & Imaging Systems LLC

$2,811,319.00 obligated so far on USAspending, May 18, 2026, contract W56KGU26CA004

Description

As published on SAM.gov with the justification of May 27, 2026.

Redacted J&A for Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays.

The contract, on USAspending

Federal procurement data the awarding office reported to FPDS, matched to this solicitation by its number.

Recipient
DRS Network & Imaging Systems LLC
UEI
MC27B7LGBL34
CAGE
32865
Vendor location
Melbourne, FL
Contract
W56KGU26CA004, definitive contract
Obligated
$2,811,319.00, current value $3,271,356, potential $8,321,532
Actions
1 between May 18, 2026 and May 18, 2026
Competition
Not Competed, 1 offer received
Set-aside reported
No Set Aside Used.
Described as
The Scope Encompasses the Design, Fabrication, and Testing of Fpas Utilizing Direct Bond Hybridization (Dbh) with a Common Ir-Transparent Material Interface.
Match
award number W56KGU26CA004 equals the contract number; same awarding office W56KGU (high confidence)
Record
USAspending award page

Publications

Every notice SAM.gov issued under this solicitation number, oldest first. Each is a separate record on SAM.

  1. May 27, 2026

    Justification

    J&A - Direct Bonding

    SAM.gov, notice 35631225f1fb4b6185ea6fc0633a99d5

  2. May 27, 2026

    Award notice

    Awarded to DRS NETWORK & IMAGING SYSTEMS LLC Melbourne for $8,321,532. SAM.gov, notice 602b0ac6c0bf46b5b5220475eb9de3d0

Also open from this buyer