HPCMP Technical Insertion BOA On Ramp Opportunity

The U.S. Army Engineering Research and Development Center (ERDC) is issuing this combined synopsis/solicitation to interested firms with the capability to on-ramp onto an existing suite of BOAs for supercomputer Technology Insertions (TIs) in support of the High Performance Computing Modernization Program (HPCMP). The estimated total remaining capacity across the BOA is $169M remaining for the ordering period.

The existing BOA suite was established in October 2021 with a five (5) year life cycle, ceasing on 03 October 2026. This notice is an invitation to any size business concern to provide a capability statement in response to this requirement. This announcement seeks to evaluate industry's ability to provide sustainable, state-of-the-art, High Performance Computing (HPC) capability for the Department of Defense (DoD) Research, Development, Test, and Evaluation (RDT&E) community.

This requirement is in direct support of the DoD HPCMP's mission - to accelerate the development and transition of advanced defense technologies into superior warfighting capabilities by exploiting and strengthening U.S. leadership in supercomputing, communications, and computational modeling. The HPCMP continues to enhance its ability to support DoD and the warfighter through the acquisition of balanced HPC systems for four DOD Supercomputing Resource Center (DSRCs).

The Government is interested in uncovering industry's ability to deliver balanced, commercially available, production-grade HPC systems, which contain an appropriate combination of processor, memory, disk I/O, interconnect, and operating system (OS) capabilities in order to conduct complex, tightly-coupled, large-scale, scientific calculations.