Sources sought
Automated Flip-Chip Die Bonder
NIST-SS24-CHIPS-0021
National Institute of Standards and Technology, Department of Commerce NIST. Semiconductor and Related Device Manufacturing.
Response deadline
March 13, 2024 at 11:00 AM EDT
Closed 918 days ago. Posted February 27, 2024. Scheduled to archive March 28, 2024.
Description
As published on SAM.gov.
Please see attachment.
Publications
Every notice SAM.gov issued under this solicitation number, oldest first. Each is a separate record on SAM.
February 27, 2024
Sources sought
Due March 13, 2024 at 11:00 AM EDT. SAM.gov, notice da42089fdf5743e1a05944de6969f4d1
Points of contact
- Jenna Bortnerjenna.bortner@nist.gov
- Tracy RettererTracy.retterer@nist.gov
Also open from this buyer
- AploPrep Liquid Handler & Nanoimager Microscope MaintenancePresolicitationNAICS 334516Gaithersburg, MDNB644020-26-01484Closes tomorrowSep 18
- Gas CylindersPresolicitationNAICS 332420Gaithersburg, MDNB305000-26-02052Closes tomorrowSep 18
- Ultra-High Vacuum (UHV) Translation StagesSolicitationNAICS 334516Gaithersburg, MD1333ND26QNB030595Closes tomorrowSep 18
- NIST Femtosecond Laser SystemCombined synopsis and solicitationNAICS 334516Gaithersburg, MD1333ND26QNB680592Closes tomorrowSep 18
- Brand Name Only: FLIR Thermal Camera BundleSolicitationSmall businessNAICS 334516Gaithersburg, MD1333ND26QNB730401Closes tomorrowSep 18