Request for Information: Next Generation Microelectronics Manufacturing 3DHI Microsystems

The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) seeks information to support a future solicitation. This “Design Challenge” solicitation is intended to advance the next generation of 3D heterogeneously integrated (3DHI) microsystems by enabling early access to the capabilities established under the Next Generation Microelectronics Manufacturing (NGMM) program.

The prototypes developed through this effort will demonstrate the unprecedented performance of 3DHI microelectronics. Through this RFI, DARPA aims to solicit further insight into the classes of 3DHI microsystems that can best leverage the NGMM integration technology roadmap to support innovative commercial and/or dual use applications. The goals of this Request for Information (RFI) include, but are not limited to:

• Identification of innovative applications that can leverage 3DHI • Identification of organizations interested in utilizing NGMM’s 3DHI capability • Identification of potential barriers to fabricating 3DHI components • Identification of additional offerings that would further promote both the use of 3DHI and engagement with NGMM