Cryogenic Microsystems Thermal Packaging RFI + Workshop Special Notice

The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) seeks information on new approaches and technologies for thermal packaging of cryogenic microsystems from 10 mK to 77 K, and the associated interconnects between these temperatures, as well as to room temperature microsystems. DARPA will also host an in-person workshop to explore the current state-of-the-art (SOA) and emerging approaches and technologies for cryogenic microsystems packaging in the range of 10 mK to 77 K. The workshop will be held on December 2, 2024, at Booz Allen Hamilton, 8283 Greensboro Drive, McLean, VA 22102 from 8:00 a.m. to 5:00 p.m. ET.