# CIRCUIT CARD ASSEMBLY

Canonical: https://abierto.us/opportunities/spe4a526t466y

- Solicitation number: SPE4A526T466Y
- Notice type: Combined synopsis and solicitation
- Status: Open. Offers due September 30, 2026
- Department: Department of Defense
- Agency: Defense Logistics Agency
- Contracting office: DLA Aviation (SPE4A5)
- NAICS: 334418 Printed Circuit Assembly (Electronic Assembly) Manufacturing
- Product or service code: 59 Electrical/Electronic Eqpt Compnts
- First posted: September 22, 2026
- Last posted: September 22, 2026
- SAM.gov: https://sam.gov/workspace/contract/opp/7d98b3723de5465f9b3c50f403c32e39/view

## Description

Proposed procurement for NSN 5998014807484 CIRCUIT CARD ASSEMBLY:
Line 0001 Qty 21     UI EA  Deliver To: DLA DISTRIBUTION DEPOT OKLAHOMA By: 0259 DAYS ADO
Approved source is 60678 00704-0778-0001.
The solicitation is an RFQ and will be available at the link provided in this notice.  Hard copies of this solicitation are not available. Specifications, plans, or drawings are not available.
All responsible sources may submit a quote which, if timely received, shall be considered.
Quotes must be submitted electronically.

## Attachments

- [7879cd16e178437fb8e846a477b0d716](https://www.dibbs.bsm.dla.mil/rfq/rfqrec.aspx?sn=SPE4A526T466Y)

## Publications

- September 22, 2026: Combined synopsis and solicitation, due September 30, 2026. Notice 7d98b3723de5465f9b3c50f403c32e39. https://sam.gov/workspace/contract/opp/7d98b3723de5465f9b3c50f403c32e39/view

## Points of contact

- Questions regarding this solicitation should be emailed to the buyer listed in block 5 of the solicitation document which can be found under the Additional Information link. If the Additional Information link does not work, please go to https://www.dibbs.bsm.dla.mil/Solicitations/ and type the solicitation number in the Global Search box., DibbsBSM@dla.mil

---
Source: SAM.gov Contract Opportunities bulk extract. Confirm deadlines on SAM.gov before responding. Cite https://abierto.us/opportunities/spe4a526t466y.
