{"canonical":"https://abierto.us/opportunities/nb6720102402085","key":"NB6720102402085","url":"https://abierto.us/opportunities/nb6720102402085","title":"NOTICE OF INTENT TO SOLE SOURCE All-Glass Microwave Microfluidic Wafers","solicitation_number":"NB672010-24-02085","notice_type":"s","open":false,"response_deadline":"2024-06-22T20:00:00Z","first_posted":"2024-06-17","last_posted":"2024-06-24","department":"COMMERCE, DEPARTMENT OF","subagency":"NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY","office":"DEPT OF COMMERCE NIST","naics":"334413","psc":"5961","set_aside":null,"place_state":"NY","place_county":"36055","place_county_name":"Monroe County","place_city":"3663000","place_city_name":"Rochester","winner":"MOSAIC MICROSYSTEMS LLC","award_amount":null,"publications":[{"notice_id":"aaa0a9ec44ab46c598a4456ace5cada0","title":"All-Glass Microwave Microfluidic Wafers","solicitation_number":"NB672010-24-02085","notice_type":"r","base_type":"r","posted":"2024-06-17","posted_at":null,"due_at":"2024-06-22T20:00:00Z","due_date":"2024-06-22","cancelled":null,"archived":null,"archive_date":"2024-07-07","award_number":null,"awardee_name":null,"amount":null,"link_sam":"https://sam.gov/workspace/contract/opp/aaa0a9ec44ab46c598a4456ace5cada0/view","enriched":false,"history":[]},{"notice_id":"c03f9f90714141d7a2061dba56d47a58","title":"NOTICE OF INTENT TO SOLE SOURCE All-Glass Microwave Microfluidic Wafers","solicitation_number":"NB672010-24-02085","notice_type":"s","base_type":"r","posted":"2024-06-24","posted_at":null,"due_at":"2024-06-29T16:00:00Z","due_date":"2024-06-29","cancelled":null,"archived":null,"archive_date":"2024-07-14","award_number":null,"awardee_name":null,"amount":null,"link_sam":"https://sam.gov/workspace/contract/opp/c03f9f90714141d7a2061dba56d47a58/view","enriched":false,"history":[]}],"latest_notice_id":"c03f9f90714141d7a2061dba56d47a58","first_type":"r","notices":[{"dates":{"posted":"2024-06-17","response_deadline":{"raw":"2024-06-22T14:00:00-06:00","utc":"2024-06-22T20:00:00Z","date":"2024-06-22","time":"14:00:00","utc_offset_seconds":-21600}},"links":{"sam":"https://sam.gov/workspace/contract/opp/aaa0a9ec44ab46c598a4456ace5cada0/view"},"naics":{"codes":["334413"],"primary":"334413"},"title":"All-Glass Microwave Microfluidic Wafers","agency":{"office":{"code":"1333ND","name":"DEPT OF COMMERCE NIST"},"subtier":{"code":"1341","name":"NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY"},"department":{"code":"013","name":"COMMERCE, DEPARTMENT OF"},"office_address":{"zip":"20899","city":"GAITHERSBURG","state":"MD","country":"USA"},"organization_type":"OFFICE"},"status":{"active":false,"archive_date":"2024-07-07","archive_type":"auto15"},"contacts":[{"name":"Clifford Nicholson","role":"primary","email":"clifford.nicholson@nist.gov","phone":"3034975185"},{"name":"Daniel Kent","role":"secondary","email":"daniel.kent@nist.gov","phone":"3034976533"}],"base_type":{"code":"r","label":"Sources Sought"},"notice_id":"aaa0a9ec44ab46c598a4456ace5cada0","provenance":{"extract":{"url":"https://s3.amazonaws.com/falextracts/Contract%20Opportunities/Archived%20Data/FY2024_archived_opportunities.csv","etag":"\"d582488fe153a9f11bf629913d176ffc-137\"","fetched_at":"2026-09-16T19:07:39.720164Z","row_sha256":"b600e4b60a8b6c2b469aac562bcbc0ab13a3d19b41887545a07025dc223989d6","last_modified":"2026-09-13T14:47:40Z"},"updated_at":"2026-09-16T19:07:39.720164Z","first_seen_at":"2026-09-16T19:07:39.720164Z"},"description":{"text":"National Institute of Standards and Technology (NIST) Acquisition Management Division Sources Sought for Commercial Item Purchase THIS SOURCES SOUGHT IS NOT A REQUEST FOR QUOTATION. It is a market research tool being used to determine potential and eligible business firms that can provide the product described herein prior to determining the method of acquisition. The National Institute of Standards & Technology (NIST) seeks information on vendors that can obtain an All-Glass Microwave Microfluidic Wafers according to the Requirements/Specifications Document attached herein. This announcement is not a Request for Quotation (RFQ) and does not commit the Government to award a contract now or in the future. No solicitation is currently available. Additionally, The Government is not obligated to and will not pay for any information received from potential sources because of this sources sought announcement. The results of this Sources Sought will be utilized to determine if any Small Business Set-aside opportunities exist. All Small Business Set-aside categories will be considered. In addition, this market research tool is being used to identify potential and eligible firms, of all sizes, prior to determining the method of acquisition and issuance of a solicitation. Because of this Sources Sought announcement, NIST may conduct a competitive procurement on the System for Award Management (sam.gov) website and subsequently award a contract. If at least two qualified small businesses are identified during this market research stage that can fulfil the requirement, in accordance with the requirement descriptions and technical specifications indicated in the Specification Document, then this acquisition shall be solicited as a small business set aside. However, NIST is seeking responses from all responsible sources, including large and small businesses (SB, SDB, WOSB, HUBZone, SDVOSB and VOSB). This requirement is assigned a NAICS code of 334413 for Semiconductor and Related Device Manufacturers with a small business size standard of 1250 Emp. The specific purpose of this Sources Sought Announcement is to determine if there are small businesses, within the parameters identified above, that can provide the specialized equipment identified in the Requirements/Specifications Document. Interested business organizations that believe they can meet the requirement should submit electronic copies of their capability statement. Please limit responses to five (5) pages or less. Responses should include the following information: 1. Company Profile to include number of employees, office location(s), Unique Entity Identifier (UEI) number and Cage Code. 2. Name of company that will provide the product. 3. Name of company that will manufacture the product. 4. Specification sheets and examples of products that meet the Specifications attached herein. 5. Typical lead time to deliver the product after receipt of award to include installation time and any necessary training that is provided. 6. Identification and verification of the company’s small business status. 7. Any other relevant information that is not listed above which the Government should consider in developing our service requirement and finalizing our market research. 8. Country of Origin for each supply or service to be provided. (Company sales brochures or marketing packages will not be considered). REQUIREMENTS OVERVIEW: See the attached Requirements/Specifications Document.","origin":"extract"},"notice_type":{"code":"r","label":"Sources Sought"},"schema_version":1,"solicitation_number":"NB672010-24-02085","place_of_performance":{"country":{"code":"USA"}},"product_service_code":"5961"},{"dates":{"posted":"2024-06-24","response_deadline":{"raw":"2024-06-29T10:00:00-06:00","utc":"2024-06-29T16:00:00Z","date":"2024-06-29","time":"10:00:00","utc_offset_seconds":-21600}},"links":{"sam":"https://sam.gov/workspace/contract/opp/c03f9f90714141d7a2061dba56d47a58/view"},"naics":{"codes":["334413"],"primary":"334413"},"title":"NOTICE OF INTENT TO SOLE SOURCE All-Glass Microwave Microfluidic Wafers","agency":{"office":{"code":"1333ND","name":"DEPT OF COMMERCE NIST"},"subtier":{"code":"1341","name":"NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY"},"department":{"code":"013","name":"COMMERCE, DEPARTMENT OF"},"office_address":{"zip":"20899","city":"GAITHERSBURG","state":"MD","country":"USA"},"organization_type":"OFFICE"},"status":{"active":false,"archive_date":"2024-07-14","archive_type":"auto15"},"contacts":[{"name":"Clifford Nicholson","role":"primary","email":"clifford.nicholson@nist.gov","phone":"3034975185"},{"name":"Daniel Kent","role":"secondary","email":"daniel.kent@nist.gov","phone":"3034976533"}],"base_type":{"code":"r","label":"Sources Sought"},"notice_id":"c03f9f90714141d7a2061dba56d47a58","provenance":{"extract":{"url":"https://s3.amazonaws.com/falextracts/Contract%20Opportunities/Archived%20Data/FY2024_archived_opportunities.csv","etag":"\"d582488fe153a9f11bf629913d176ffc-137\"","fetched_at":"2026-09-16T19:07:39.720164Z","row_sha256":"4e3fefaaffc9cdb961f9b58f80dbb705f0955e21d998a00d5f3f87b5cb8abde4","last_modified":"2026-09-13T14:47:40Z"},"updated_at":"2026-09-16T19:07:39.720164Z","first_seen_at":"2026-09-16T19:07:39.720164Z"},"description":{"text":"The National Institute of Standards and Technology (NIST) Acquisition Management Division on behalf of the Communications Technology Laboratory, RF Technology Division intends to negotiate with Mosaic Microsystems LLC on a sole source basis under the authority of FAR Subpart 13.106-1(b), soliciting from a single source, for the acquisition of All-Glass Microwave Microfluidic Wafers referenced herein. Specific Requirements: Item Specifications and Quantities: Item 1: Encapsulated All-Glass Microwave Microfluidic Wafers (8-inch wafers) Quantity: 4 EA Specifications: 1.1 High purity fused silica for substrate and microfluidic roof wafers. 1.2 One platinum resistor deposition layer (25 nm) on substrate wafer. 1.3 One platinum conductor deposition layer (600 nm) on top of the resistor layer. 1.4 Platinum layers shall be adhered with non-magnetic adhesion layers. 1.5 Metallization layer tolerances of 0.5 microns. 1.6 One patterned silicon dioxide layer (1-5 microns thick) on top of platinum electrode layer, polished with chemical-mechanical polishing to required smoothness of RMS less than or equal to 1 nm. 1.7 Silicon dioxide layer shall be adhered to the platinum electrode layer with silicon nitride. 1.8 All patterns will be provided by NIST as .gds files. 1.9 Hermetically bonded glass channels to substrate wafer, 100-micron depth channels. 1.10 Channels shall have straight sidewalls achieved through, for example, laser cutting. 1.11 Platinum electrodes must be directly exposed to the channel. 1.12 Platinum electrode ends (at least 500 microns width) must be fully exposed for probe station measurements. 1.13 Any etching for exposure of platinum electrodes must not exceed an over-etch of 50 nm below the substrate surface. 1.14 Temperature treatments of wafers in process should not exceed 300 degrees Celsius. 1.15 Channel to substrate misalignment tolerance of 10 microns. 1.16 Devices should withstand 100 psi applied fluid pressure. 1.17 Vias to the fluid channels should come through the top wafer (the wafer with channel etched out). 1.18 Wafers should be fully diced into individual chips. Item 2: Fused Silica Wafers with Calibration Artifacts (8-inch wafers) Quantity: 1 EA 2.1 High purity fused silica for substrate wafer. 2.2 One platinum resistor deposition layer (25 nm) on substrate wafer. 2.3 One platinum conductor deposition layer (600 nm) on top of the resistor layer. 2.4 Platinum layers shall be adhered with non-magnetic adhesion layers. 2.5 Metallization layer tolerances of 0.5 microns. 2.6 One patterned silicon dioxide layer (1-5 microns thick) on top of platinum electrode layer, polished with chemical-mechanical polishing to required smoothness of RMS less than or equal to 1 nm. 2.7 Silicon dioxide layer shall be adhered to the platinum electrode layer with silicon nitride. 2.8 All patterns will be provided by NIST as .gds files. 2.9 Platinum electrode ends (at least 500 microns width) must be fully exposed for probe station measurements. 2.9 Any etching for exposure of platinum electrodes must not exceed an over-etch of 50 nm below the substrate surface. 2.10 Wafer should be fully diced into individual chips. NAICS Code is 334413 - Semiconductor and Related Device Manufacturing, with a Size Standard of 1250 Employees. NIST anticipates negotiating and awarding a firm-fixed-price purchase order to Mosaic Microsystems for this requirement. JUSTIFICATION FOR OTHER THAN FULL AN OPEN COMPETITION: Market research resulted in Mosaic Microsystems LLC being the only vendor to align and hermetically seal microwave coplanar waveguides into all-glass microfluidic channels. Mosaic Microsystems was the only company to fulfill the technical specifications laid out in that procurement and developed a specialized wafer alignment process to meet the needs of the procurement. No other manufacturers are known to produce the proprietary wafer bonding technology to create the hermetic seals at low enough temperatures and pressures to avoid deforming the embedded microwave circuitry. Interested parties that can demonstrate they could satisfy the requirement listed above for NIST must clearly and unambiguously identify their capability to do so in writing on or before the response date for this notice. This notice of intent is not a solicitation. Information submitted in response to this notice will be used solely to determine whether competitive procedures could be used for this acquisition. If competitive procedures are not used, it is estimated that an award will be issued 4th Quarter FY24. Any questions regarding this notice must be submitted in writing via email to clifford.nicholson@nist.gov. All responses to this notice of intent must be submitted to clifford.nicholson@nist.gov no later than 6/29/2024 at 10:00 a.m. MDT.","origin":"extract"},"notice_type":{"code":"s","label":"Special Notice"},"schema_version":1,"solicitation_number":"NB672010-24-02085","place_of_performance":{"country":{"code":"USA"}},"product_service_code":"5961"}],"due_at":"2024-06-22T20:00:00Z","due_date":"2024-06-22","closes_at":"2024-06-22T20:00:00Z","awardable":false,"dept_key":"d-013","dept_name":"COMMERCE, DEPARTMENT OF","sub_key":"s-1341","sub_name":"NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY","office_key":"o-1333ND","office_name":"DEPT OF COMMERCE NIST","state":"NY","county":"36055","county_name":"Monroe County","city":"3663000","city_name":"Rochester","country":"USA","winner_key":"JPLDLBVEEUP2","amount":null,"linked_awards":2,"cancelled":false,"archived":false,"updated_at":"2026-09-16T21:18:12.857524Z","principal_notice_id":"c03f9f90714141d7a2061dba56d47a58","description":{"text":"The National Institute of Standards and Technology (NIST) Acquisition Management Division on behalf of the Communications Technology Laboratory, RF Technology Division intends to negotiate with Mosaic Microsystems LLC on a sole source basis under the authority of FAR Subpart 13.106-1(b), soliciting from a single source, for the acquisition of All-Glass Microwave Microfluidic Wafers referenced herein. Specific Requirements: Item Specifications and Quantities: Item 1: Encapsulated All-Glass Microwave Microfluidic Wafers (8-inch wafers) Quantity: 4 EA Specifications: 1.1 High purity fused silica for substrate and microfluidic roof wafers. 1.2 One platinum resistor deposition layer (25 nm) on substrate wafer. 1.3 One platinum conductor deposition layer (600 nm) on top of the resistor layer. 1.4 Platinum layers shall be adhered with non-magnetic adhesion layers. 1.5 Metallization layer tolerances of 0.5 microns. 1.6 One patterned silicon dioxide layer (1-5 microns thick) on top of platinum electrode layer, polished with chemical-mechanical polishing to required smoothness of RMS less than or equal to 1 nm. 1.7 Silicon dioxide layer shall be adhered to the platinum electrode layer with silicon nitride. 1.8 All patterns will be provided by NIST as .gds files. 1.9 Hermetically bonded glass channels to substrate wafer, 100-micron depth channels. 1.10 Channels shall have straight sidewalls achieved through, for example, laser cutting. 1.11 Platinum electrodes must be directly exposed to the channel. 1.12 Platinum electrode ends (at least 500 microns width) must be fully exposed for probe station measurements. 1.13 Any etching for exposure of platinum electrodes must not exceed an over-etch of 50 nm below the substrate surface. 1.14 Temperature treatments of wafers in process should not exceed 300 degrees Celsius. 1.15 Channel to substrate misalignment tolerance of 10 microns. 1.16 Devices should withstand 100 psi applied fluid pressure. 1.17 Vias to the fluid channels should come through the top wafer (the wafer with channel etched out). 1.18 Wafers should be fully diced into individual chips. Item 2: Fused Silica Wafers with Calibration Artifacts (8-inch wafers) Quantity: 1 EA 2.1 High purity fused silica for substrate wafer. 2.2 One platinum resistor deposition layer (25 nm) on substrate wafer. 2.3 One platinum conductor deposition layer (600 nm) on top of the resistor layer. 2.4 Platinum layers shall be adhered with non-magnetic adhesion layers. 2.5 Metallization layer tolerances of 0.5 microns. 2.6 One patterned silicon dioxide layer (1-5 microns thick) on top of platinum electrode layer, polished with chemical-mechanical polishing to required smoothness of RMS less than or equal to 1 nm. 2.7 Silicon dioxide layer shall be adhered to the platinum electrode layer with silicon nitride. 2.8 All patterns will be provided by NIST as .gds files. 2.9 Platinum electrode ends (at least 500 microns width) must be fully exposed for probe station measurements. 2.9 Any etching for exposure of platinum electrodes must not exceed an over-etch of 50 nm below the substrate surface. 2.10 Wafer should be fully diced into individual chips. NAICS Code is 334413 - Semiconductor and Related Device Manufacturing, with a Size Standard of 1250 Employees. NIST anticipates negotiating and awarding a firm-fixed-price purchase order to Mosaic Microsystems for this requirement. JUSTIFICATION FOR OTHER THAN FULL AN OPEN COMPETITION: Market research resulted in Mosaic Microsystems LLC being the only vendor to align and hermetically seal microwave coplanar waveguides into all-glass microfluidic channels. Mosaic Microsystems was the only company to fulfill the technical specifications laid out in that procurement and developed a specialized wafer alignment process to meet the needs of the procurement. No other manufacturers are known to produce the proprietary wafer bonding technology to create the hermetic seals at low enough temperatures and pressures to avoid deforming the embedded microwave circuitry. Interested parties that can demonstrate they could satisfy the requirement listed above for NIST must clearly and unambiguously identify their capability to do so in writing on or before the response date for this notice. This notice of intent is not a solicitation. Information submitted in response to this notice will be used solely to determine whether competitive procedures could be used for this acquisition. If competitive procedures are not used, it is estimated that an award will be issued 4th Quarter FY24. Any questions regarding this notice must be submitted in writing via email to clifford.nicholson@nist.gov. All responses to this notice of intent must be submitted to clifford.nicholson@nist.gov no later than 6/29/2024 at 10:00 a.m. MDT.","html":null,"origin":"extract"},"contacts":[{"name":"Clifford Nicholson","role":"primary","email":"clifford.nicholson@nist.gov","phone":"3034975185"},{"name":"Daniel Kent","role":"secondary","email":"daniel.kent@nist.gov","phone":"3034976533"}],"place_of_performance":{"country":{"code":"USA"}},"office_address":{"zip":"20899","city":"GAITHERSBURG","state":"MD","country":"USA"},"naics_codes":["334413"],"award":null,"attachments":[],"awards":[{"award_key":"CONT_AWD_1333ND24PNB670472_1341_-NONE-_-NONE-","permalink":"https://www.usaspending.gov/award/CONT_AWD_1333ND24PNB670472_1341_-NONE-_-NONE-/","piid":"1333ND24PNB670472","parent_piid":null,"award_type":"PURCHASE ORDER","vendor_key":"JPLDLBVEEUP2","recipient_name":"MOSAIC MICROSYSTEMS LLC","recipient_uei":"JPLDLBVEEUP2","recipient_cage":"82FS0","recipient_city":"ROCHESTER","recipient_state":"NY","sub_name":"National Institute of Standards and Technology","office_name":"DEPT OF COMMERCE NIST","office_key":"o-1333ND","first_action_date":"2024-09-09","last_action_date":"2026-04-30","actions":7,"obligated":"65693.00","current_total_value":"65693.00","potential_total_value":"65693.00","naics":"334413","psc":"5961","extent_competed":"NOT COMPETED UNDER SAP","set_aside":"NO SET ASIDE USED.","offers_received":1,"description":"ALL-GLASS MICROWAVE MICROFLUIDIC WAFERS","method":"solicitation","confidence":"high","evidence":["solicitation number NB6720102402085 equals the FPDS solicitation identifier","same awarding office 1333ND"],"opportunity_key":null,"opportunity_title":null}],"related":[{"key":"1333QNB640598","latest_notice_id":"64bd3ab73a4e412d99f61b4f0f80778c","title":"Stable Isotopes for 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