# Microelectronics Sourcing Capability for Tobyhanna Army Depot (RFI 2) Canonical: https://abierto.us/opportunities/microelectronicssourcingfortyad2 - Solicitation number: MicroelectronicsSourcingforTYAD2 - Notice type: Sources sought - Status: Closed. Deadline was October 27, 2026 at 1:00 PM EDT - Department: Department of the Army - Agency: Department of the Army - Contracting office: W0ML USA Dep Tobyhanna (W25G1V) - NAICS: 334413 Semiconductor and Related Device Manufacturing - Product or service code: 5962 Microcircuits, Electronic - Place of performance: Pennsylvania - Who can bid, by location: Anywhere in the US. Location does not limit who can bid: a product shipped to the buyer, research at the performer's facility, or work at the contractor's site. A state shown is the delivery point. - County: Monroe County (FIPS 42089). https://abierto.us/counties/monroe-county-pa-42089 - First posted: October 8, 2026 - Last posted: October 8, 2026 - SAM.gov: https://sam.gov/workspace/contract/opp/280067bd516a4d65881aee71c95bfd17/view ## Description The U.S. Army Contracting Command (ACC) is issuing this Request for Information (RFI) as market research to identify qualified Original Component Manufacturers (OCMs) and their Tier-1 direct distributors (directly working with manufacturer) capable of supplying commercial-off-the-shelf (COTS), industrial, and defense-grade microelectronics in sustained, large-scale production volumes for Circuit Card Assembly (CCA) integration. The primary objective is to transition from spot-market, broker-dependent, and decentralized procurement models toward resilient, long-term, direct-tier relationships with primary component fabricators and direct suppliers. The Government seeks insights into volume production capacity, minimum lead times, wafer/die allocations, packaging assurances, and transparent chain-of-custody protocols. Disclaimer: This RFI is published solely for information and planning purposes. It does not constitute a Request for Proposal (RFP), Invitation for Bid (IFB), or an obligation on the part of the Government to acquire any products or services. The Government will not reimburse respondents for any costs incurred in preparing responses. See Attachment 1 - Request for Information for a full description of the Government's requirement for High-Volume Microelectronics Sourcing: Direct Manufacturer & Tier-1 Production Supply Chains. ## Attachments - [Attachment 1 - Request for Information Microelectronics Sourcing.docx](https://sam.gov/api/prod/opps/v3/opportunities/resources/files/73332d6d3af34043b140b7de309178e4/download) ## Open now in the same industry 25 open in NAICS 334413. - HEATER,THERMAL RELEASE (SPE7M527T1295), due November 2, 2026. https://abierto.us/opportunities/spe7m527t1295 - PANEL,BODY,VEHICULAR (SPE7L327T1292), due November 2, 2026. https://abierto.us/opportunities/spe7l327t1292 - SEMICONDUCTOR DEVICE,D (SPE7M527T1291), due November 2, 2026. https://abierto.us/opportunities/spe7m527t1291 ## Publications - October 8, 2026: Sources sought, due October 27, 2026 at 1:00 PM EDT. Notice 21e2e5bc39ab473db7dc65d4ecd12ce7. https://sam.gov/workspace/contract/opp/21e2e5bc39ab473db7dc65d4ecd12ce7/view - October 8, 2026: Sources sought, due October 27, 2026 at 1:00 PM EDT. Notice 280067bd516a4d65881aee71c95bfd17. https://sam.gov/workspace/contract/opp/280067bd516a4d65881aee71c95bfd17/view ## Points of contact - Mark Buonomo, mark.buonomo2.civ@army.mil, 5706159781 --- Source: SAM.gov Contract Opportunities bulk extract. Confirm deadlines on SAM.gov before responding. Cite https://abierto.us/opportunities/microelectronicssourcingfortyad2.