See Attachment 1 - Request for Information for a full description of the Government's requirement for High-Volume Microelectronics Sourcing: Direct Manufacturer & Tier-1 Production Supply Chains.
","text":"See Attachment 1 - Request for Information for a full description of the Government's requirement for High-Volume Microelectronics Sourcing: Direct Manufacturer & Tier-1 Production Supply Chains.","origin":"detail"},"notice_type":{"code":"r","label":"Sources Sought"},"schema_version":1,"solicitation_number":"MicroelectronicsSourcingforTYAD2","place_of_performance":{"zip":"18466","state":{"code":"PA","name":"Pennsylvania"},"country":{"code":"USA","name":"UNITED STATES"}},"product_service_code":"5962"},{"dates":{"posted":"2026-10-08","posted_at":"2026-10-08T12:59:39.707Z","created_at":"2026-10-08T12:57:53.137Z","modified_at":"2026-10-08T12:59:39.714Z","response_deadline":{"raw":"2026-10-27T13:00:00-04:00","utc":"2026-10-27T17:00:00Z","date":"2026-10-27","time":"13:00:00","timezone":"America/New_York","utc_offset_seconds":-14400}},"links":{"sam":"https://sam.gov/workspace/contract/opp/280067bd516a4d65881aee71c95bfd17/view"},"naics":{"codes":["334413"],"primary":"334413"},"title":"Microelectronics Sourcing Capability for Tobyhanna Army Depot (RFI 2)","agency":{"office":{"code":"W25G1V","name":"W0ML USA DEP TOBYHANNA"},"subtier":{"code":"2100","name":"DEPT OF THE ARMY"},"department":{"code":"021","name":"DEPT OF DEFENSE"},"office_address":{"zip":"18466-5079","city":"TOBYHANNA","state":"PA","country":"USA"},"organization_id":"500043675","organization_type":"OFFICE"},"status":{"active":true,"latest":true,"deleted":false,"archived":false,"cancelled":false,"publication":"published","archive_date":"2026-11-11","archive_type":"auto15"},"history":[{"index":2,"title":"Microelectronics Sourcing Capability for Tobyhanna Army Depot (RFI 2)","action":"publish","latest":true,"deleted":false,"archived":false,"cancelled":false,"posted_at":"2026-10-08T12:59:39.707Z","notice_type":{"code":"r","label":"Sources Sought"},"request_type":"modify","opportunity_id":"280067bd516a4d65881aee71c95bfd17","solicitation_number":"MicroelectronicsSourcingforTYAD2","parent_opportunity_id":"21e2e5bc39ab473db7dc65d4ecd12ce7"},{"index":1,"title":"Microelectronics Sourcing Capability for Tobyhanna Army Depot (RFI 2))","action":"publish","latest":false,"deleted":false,"archived":false,"cancelled":false,"posted_at":"2026-10-08T12:54:16.234Z","notice_type":{"code":"r","label":"Sources Sought"},"request_type":"submit","opportunity_id":"21e2e5bc39ab473db7dc65d4ecd12ce7","solicitation_number":"MicroelectronicsSourcingforTYAD2"}],"contacts":[{"name":"Mark Buonomo","role":"primary","email":"mark.buonomo2.civ@army.mil","phone":"5706159781"}],"base_type":{"code":"r","label":"Sources Sought"},"notice_id":"280067bd516a4d65881aee71c95bfd17","lineage_id":"21e2e5bc39ab473db7dc65d4ecd12ce7","provenance":{"detail":{"endpoints":["opportunity","resources","history"],"fetched_at":"2026-10-10T00:05:35.724806181Z"},"extract":{"url":"https://s3.amazonaws.com/falextracts/Contract%20Opportunities/datagov/ContractOpportunitiesFullCSV.csv","etag":"\"88a39a008f4c126e532dc85ce516a626-26\"","fetched_at":"2026-10-09T04:25:46.346911714Z","row_sha256":"8ffb5f8fc6b70e3225ada4115ec84eafd7243c13cc6fac2d23cd2d6f7f247479","last_modified":"2026-10-09T03:30:27Z"},"updated_at":"2026-10-10T00:05:35.724806181Z","first_seen_at":"2026-10-09T04:25:46.346911714Z"},"description":{"html":"The U.S. Army Contracting Command (ACC) is issuing this Request for Information (RFI) as market research to identify qualified Original Component Manufacturers (OCMs) and their Tier-1 direct distributors (directly working with manufacturer) capable of supplying commercial-off-the-shelf (COTS), industrial, and defense-grade microelectronics in sustained, large-scale production volumes for Circuit Card Assembly (CCA) integration.
\n\nThe primary objective is to transition from spot-market, broker-dependent, and decentralized procurement models toward resilient, long-term, direct-tier relationships with primary component fabricators and direct suppliers. The Government seeks insights into volume production capacity, minimum lead times, wafer/die allocations, packaging assurances, and transparent chain-of-custody protocols.
\n\nDisclaimer: This RFI is published solely for information and planning purposes. It does not constitute a Request for Proposal (RFP), Invitation for Bid (IFB), or an obligation on the part of the Government to acquire any products or services. The Government will not reimburse respondents for any costs incurred in preparing responses.
\n\nSee Attachment 1 - Request for Information for a full description of the Government's requirement for High-Volume Microelectronics Sourcing: Direct Manufacturer & Tier-1 Production Supply Chains.
","text":"The U.S. Army Contracting Command (ACC) is issuing this Request for Information (RFI) as market research to identify qualified Original Component Manufacturers (OCMs) and their Tier-1 direct distributors (directly working with manufacturer) capable of supplying commercial-off-the-shelf (COTS), industrial, and defense-grade microelectronics in sustained, large-scale production volumes for Circuit Card Assembly (CCA) integration.\n\nThe primary objective is to transition from spot-market, broker-dependent, and decentralized procurement models toward resilient, long-term, direct-tier relationships with primary component fabricators and direct suppliers. The Government seeks insights into volume production capacity, minimum lead times, wafer/die allocations, packaging assurances, and transparent chain-of-custody protocols.\n\nDisclaimer: This RFI is published solely for information and planning purposes. It does not constitute a Request for Proposal (RFP), Invitation for Bid (IFB), or an obligation on the part of the Government to acquire any products or services. The Government will not reimburse respondents for any costs incurred in preparing responses.\n\nSee Attachment 1 - Request for Information for a full description of the Government's requirement for High-Volume Microelectronics Sourcing: Direct Manufacturer & Tier-1 Production Supply Chains.","origin":"detail"},"notice_type":{"code":"r","label":"Sources Sought"},"schema_version":1,"solicitation_number":"MicroelectronicsSourcingforTYAD2","place_of_performance":{"zip":"18466","state":{"code":"PA","name":"Pennsylvania"},"country":{"code":"USA","name":"UNITED STATES"}},"product_service_code":"5962"}],"due_at":"2026-10-27T17:00:00Z","due_date":"2026-10-27","closes_at":"2026-10-27T17:00:00Z","awardable":true,"dept_key":"d-021","dept_name":"DEPT OF DEFENSE","sub_key":"s-2100","sub_name":"DEPT OF THE ARMY","office_key":"o-W25G1V","office_name":"W0ML USA DEP TOBYHANNA","state":"PA","county":"42089","county_name":"Monroe County","city":null,"city_name":null,"country":"USA","state_source":null,"state_evidence":null,"site_key":"tobyhanna-army-depot-pa","winner_key":null,"amount":null,"linked_awards":0,"cancelled":false,"archived":false,"updated_at":"2026-10-09T04:30:03.659222Z","principal_notice_id":"280067bd516a4d65881aee71c95bfd17","description":{"text":"The U.S. Army Contracting Command (ACC) is issuing this Request for Information (RFI) as market research to identify qualified Original Component Manufacturers (OCMs) and their Tier-1 direct distributors (directly working with manufacturer) capable of supplying commercial-off-the-shelf (COTS), industrial, and defense-grade microelectronics in sustained, large-scale production volumes for Circuit Card Assembly (CCA) integration.\n\nThe primary objective is to transition from spot-market, broker-dependent, and decentralized procurement models toward resilient, long-term, direct-tier relationships with primary component fabricators and direct suppliers. The Government seeks insights into volume production capacity, minimum lead times, wafer/die allocations, packaging assurances, and transparent chain-of-custody protocols.\n\nDisclaimer: This RFI is published solely for information and planning purposes. It does not constitute a Request for Proposal (RFP), Invitation for Bid (IFB), or an obligation on the part of the Government to acquire any products or services. The Government will not reimburse respondents for any costs incurred in preparing responses.\n\nSee Attachment 1 - Request for Information for a full description of the Government's requirement for High-Volume Microelectronics Sourcing: Direct Manufacturer & Tier-1 Production Supply Chains.","html":"The U.S. Army Contracting Command (ACC) is issuing this Request for Information (RFI) as market research to identify qualified Original Component Manufacturers (OCMs) and their Tier-1 direct distributors (directly working with manufacturer) capable of supplying commercial-off-the-shelf (COTS), industrial, and defense-grade microelectronics in sustained, large-scale production volumes for Circuit Card Assembly (CCA) integration.
\n\nThe primary objective is to transition from spot-market, broker-dependent, and decentralized procurement models toward resilient, long-term, direct-tier relationships with primary component fabricators and direct suppliers. The Government seeks insights into volume production capacity, minimum lead times, wafer/die allocations, packaging assurances, and transparent chain-of-custody protocols.
\n\nDisclaimer: This RFI is published solely for information and planning purposes. It does not constitute a Request for Proposal (RFP), Invitation for Bid (IFB), or an obligation on the part of the Government to acquire any products or services. The Government will not reimburse respondents for any costs incurred in preparing responses.
\n\nSee Attachment 1 - Request for Information for a full description of the Government's requirement for High-Volume Microelectronics Sourcing: Direct Manufacturer & Tier-1 Production Supply Chains.
","origin":"detail"},"contacts":[{"name":"Mark Buonomo","role":"primary","email":"mark.buonomo2.civ@army.mil","phone":"5706159781"}],"place_of_performance":{"zip":"18466","state":{"code":"PA","name":"Pennsylvania"},"country":{"code":"USA","name":"UNITED STATES"}},"office_address":{"zip":"18466-5079","city":"TOBYHANNA","state":"PA","country":"USA"},"naics_codes":["334413"],"award":null,"attachments":[{"resource_id":"73332d6d3af34043b140b7de309178e4","name":"Attachment 1 - Request for Information Microelectronics Sourcing.docx","kind":"file","mime_type":".docx","size_bytes":33260,"posted_at":"2026-10-08T12:54:16.234Z","export_controlled":false,"sha256":null,"url":"https://sam.gov/api/prod/opps/v3/opportunities/resources/files/73332d6d3af34043b140b7de309178e4/download","mirrored":false}],"awards":[],"related":[],"similar_open":[{"key":"SPE7M527T1295","latest_notice_id":"54cd77135cee4c20a6a290e8b820b367","title":"59--HEATER,THERMAL RELEASE","solicitation_number":"SPE7M527T1295","notice_type":"k","first_type":"k","first_posted":"2026-10-22","last_posted":"2026-10-22","notices":1,"due_at":null,"due_date":"2026-11-02","closes_at":"2026-11-03T00:00:00Z","awardable":true,"open":true,"removed":false,"dept_key":"d-097","dept_name":"DEPT OF DEFENSE","sub_key":"s-97AS","sub_name":"DEFENSE LOGISTICS AGENCY","office_key":"o-SPE7M5","office_name":"DLA WEAPONS SUPPORT","naics":"334413","psc":"59","set_aside":null,"state":null,"county":null,"county_name":null,"city":null,"city_name":null,"country":null,"place_scope":"nationwide","state_source":null,"state_evidence":"LEASE: LINE 0001 QTY 42 UI EA DELIVER TO: W1A8 DLA DISTRIBUTION BY:","site":null,"site_key":null,"winner":null,"winner_key":null,"amount":null,"linked_awards":0,"cancelled":false,"archived":false,"removed_at":null,"updated_at":"2026-10-23T03:46:32.604852Z"},{"key":"SPE7L327T1292","latest_notice_id":"36467f8da20e47679084f120aef41edd","title":"25--PANEL,BODY,VEHICULAR","solicitation_number":"SPE7L327T1292","notice_type":"k","first_type":"k","first_posted":"2026-10-22","last_posted":"2026-10-22","notices":1,"due_at":null,"due_date":"2026-11-02","closes_at":"2026-11-03T00:00:00Z","awardable":true,"open":true,"removed":false,"dept_key":"d-097","dept_name":"DEPT OF DEFENSE","sub_key":"s-97AS","sub_name":"DEFENSE LOGISTICS AGENCY","office_key":"o-SPE7L3","office_name":"DLA WEAPONS SUPPORT","naics":"334413","psc":"25","set_aside":"SBA","state":null,"county":null,"county_name":null,"city":null,"city_name":null,"country":null,"place_scope":"nationwide","state_source":null,"state_evidence":"LAR: LINE 0001 QTY 261 UI EA DELIVER TO: DLA DISTRIBUTION RED RIVER BY:","site":null,"site_key":null,"winner":null,"winner_key":null,"amount":null,"linked_awards":0,"cancelled":false,"archived":false,"removed_at":null,"updated_at":"2026-10-23T03:46:32.604852Z"},{"key":"SPE7M527T1291","latest_notice_id":"7e1ae20fc7ce41d7a74e01a61a7df842","title":"59--SEMICONDUCTOR DEVICE,D","solicitation_number":"SPE7M527T1291","notice_type":"k","first_type":"k","first_posted":"2026-10-22","last_posted":"2026-10-22","notices":1,"due_at":null,"due_date":"2026-11-02","closes_at":"2026-11-03T00:00:00Z","awardable":true,"open":true,"removed":false,"dept_key":"d-097","dept_name":"DEPT OF DEFENSE","sub_key":"s-97AS","sub_name":"DEFENSE LOGISTICS AGENCY","office_key":"o-SPE7M5","office_name":"DLA WEAPONS SUPPORT","naics":"334413","psc":"59","set_aside":"SBA","state":null,"county":null,"county_name":null,"city":null,"city_name":null,"country":null,"place_scope":"nationwide","state_source":null,"state_evidence":"CE,D: LINE 0001 QTY 21 UI EA DELIVER TO: DLA DISTRIBUTION SAN DIEGO BY:","site":null,"site_key":null,"winner":null,"winner_key":null,"amount":null,"linked_awards":0,"cancelled":false,"archived":false,"removed_at":null,"updated_at":"2026-10-23T03:46:32.604852Z"}],"similar_open_total":25}