{"canonical":"https://abierto.us/opportunities/hq0727qsj0002","key":"HQ0727QSJ0002","url":"https://abierto.us/opportunities/hq0727qsj0002","title":"Fifteen (15) TickDev Rev2 PCBs","solicitation_number":"HQ0727QSJ0002","notice_type":"u","open":false,"response_deadline":null,"first_posted":"2026-09-09","last_posted":"2026-09-09","department":"DEPT OF DEFENSE","subagency":"DEFENSE MICROELECTRONICS ACTIVITY (DMEA)","office":"DEFENSE MICROELECTRONICS ACTIVITY","naics":"334418","psc":"5998","set_aside":null,"place_state":"WA","winner":null,"award_amount":null,"publications":[{"notice_id":"b3469ebce8084d94bfa77ac696595e83","title":"Fifteen (15) TickDev Rev2 PCBs","solicitation_number":"HQ0727QSJ0002","notice_type":"u","base_type":"u","posted":"2026-09-09","posted_at":null,"due_at":null,"due_date":null,"cancelled":null,"archived":null,"archive_date":"2026-10-09","award_number":"HQ072726FE106","awardee_name":null,"amount":null,"link_sam":"https://sam.gov/workspace/contract/opp/b3469ebce8084d94bfa77ac696595e83/view","enriched":false,"history":[]}],"latest_notice_id":"b3469ebce8084d94bfa77ac696595e83","first_type":"u","notices":[{"award":{"date":"2026-09-03","number":"HQ072726FE106"},"dates":{"posted":"2026-09-09","award_date":"2026-09-03"},"links":{"sam":"https://sam.gov/workspace/contract/opp/b3469ebce8084d94bfa77ac696595e83/view"},"naics":{"codes":["334418"],"primary":"334418"},"title":"Fifteen (15) TickDev Rev2 PCBs","agency":{"office":{"code":"HQ0727","name":"DEFENSE MICROELECTRONICS ACTIVITY"},"subtier":{"code":"9771","name":"DEFENSE MICROELECTRONICS ACTIVITY (DMEA)"},"department":{"code":"097","name":"DEPT OF DEFENSE"},"office_address":{"zip":"956522100","city":"MCCLELLAN","state":"CA","country":"USA"},"organization_type":"OFFICE"},"status":{"active":true,"archive_date":"2026-10-09","archive_type":"auto30"},"contacts":[{"name":"Shon Jessup","role":"primary","email":"shon.o.jessup.civ@mail.mil","phone":"9169404913"}],"base_type":{"code":"u","label":"Justification"},"notice_id":"b3469ebce8084d94bfa77ac696595e83","provenance":{"extract":{"url":"https://s3.amazonaws.com/falextracts/Contract%20Opportunities/datagov/ContractOpportunitiesFullCSV.csv","etag":"\"3f59209463433eba6899e195a597c64d-29\"","fetched_at":"2026-09-16T07:50:12.777658Z","row_sha256":"de2b7327d69c376ef939b86cc52f01b2ad319ced9bef78af68c1c0e7a016e27d","last_modified":"2026-09-16T03:30:52Z"},"updated_at":"2026-09-16T07:50:12.777658Z","first_seen_at":"2026-09-15T22:52:52.472456Z"},"description":{"text":"The Defense Microelectronics Activity (DMEA) has awarded a follow-on order for fifteen (15) custom Printed Circuit Boards (PCBs) for the TickDev Rev2 requirement to an established Blanket Purchase Agreement (BPA) holder. 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