{"canonical":"https://abierto.us/opportunities/hq072725qrt04","key":"HQ072725QRT04","url":"https://abierto.us/opportunities/hq072725qrt04","title":"Multiple Award PCB Fab and Assembly BPAs 2026-2030","solicitation_number":"HQ072725QRT04","notice_type":"k","open":false,"response_deadline":"2025-12-15T20:00:00Z","first_posted":"2025-07-24","last_posted":"2025-12-01","department":"DEPT OF DEFENSE","subagency":"DEFENSE MICROELECTRONICS ACTIVITY (DMEA)","office":"DEFENSE MICROELECTRONICS ACTIVITY","naics":"334418","psc":"5998","set_aside":"SBA","place_state":null,"place_county":null,"place_county_name":null,"place_city":null,"place_city_name":null,"winner":"SIERRA CIRCUITS, INC.","award_amount":null,"publications":[{"notice_id":"eb08aee2ad784eeda66fd2f783222610","title":"Multiple Award PCB Fab and Assembly BPAs 2026-2030","solicitation_number":"HQ072725QRT04","notice_type":"k","base_type":"k","posted":"2025-07-24","posted_at":null,"due_at":"2025-08-15T21:00:00Z","due_date":"2025-08-15","cancelled":null,"archived":null,"archive_date":"2025-08-30","award_number":null,"awardee_name":null,"amount":null,"link_sam":"https://sam.gov/workspace/contract/opp/eb08aee2ad784eeda66fd2f783222610/view","enriched":false,"history":[]},{"notice_id":"74b161340dd349269ce67689079e66aa","title":"Multiple Award PCB Fab and Assembly BPAs 2026-2030","solicitation_number":"HQ072725QRT04","notice_type":"k","base_type":"k","posted":"2025-07-25","posted_at":null,"due_at":"2025-08-15T21:00:00Z","due_date":"2025-08-15","cancelled":null,"archived":null,"archive_date":"2025-08-30","award_number":null,"awardee_name":null,"amount":null,"link_sam":"https://sam.gov/workspace/contract/opp/74b161340dd349269ce67689079e66aa/view","enriched":false,"history":[]},{"notice_id":"1ab0234629644a23a5776bf22eaa3fb0","title":"Multiple Award PCB Fab and Assembly BPAs 2026-2030","solicitation_number":"HQ072725QRT04","notice_type":"k","base_type":"k","posted":"2025-07-29","posted_at":null,"due_at":"2025-08-15T21:00:00Z","due_date":"2025-08-15","cancelled":null,"archived":null,"archive_date":"2025-08-30","award_number":null,"awardee_name":null,"amount":null,"link_sam":"https://sam.gov/workspace/contract/opp/1ab0234629644a23a5776bf22eaa3fb0/view","enriched":false,"history":[]},{"notice_id":"af066fbd52ee421c88d8842e21811234","title":"Multiple Award PCB Fab and Assembly BPAs 2026-2030","solicitation_number":"HQ072725QRT04","notice_type":"k","base_type":"k","posted":"2025-08-15","posted_at":null,"due_at":"2025-08-18T21:00:00Z","due_date":"2025-08-18","cancelled":null,"archived":null,"archive_date":"2025-09-02","award_number":null,"awardee_name":null,"amount":null,"link_sam":"https://sam.gov/workspace/contract/opp/af066fbd52ee421c88d8842e21811234/view","enriched":false,"history":[]},{"notice_id":"85968c20af7d4cd3b715b531c42daa71","title":"Multiple Award PCB Fab and Assembly BPAs 2026-2030","solicitation_number":"HQ072725QRT04","notice_type":"k","base_type":"k","posted":"2025-12-01","posted_at":null,"due_at":"2025-12-15T20:00:00Z","due_date":"2025-12-15","cancelled":null,"archived":null,"archive_date":"2025-12-30","award_number":null,"awardee_name":null,"amount":null,"link_sam":"https://sam.gov/workspace/contract/opp/85968c20af7d4cd3b715b531c42daa71/view","enriched":false,"history":[]},{"notice_id":"cb3493794b044584a41f1d332e80dfd0","title":"Multiple Award PCB Fab and Assembly BPAs 2026-2030","solicitation_number":"HQ072725QRT04","notice_type":"k","base_type":"k","posted":"2025-12-01","posted_at":null,"due_at":"2025-12-15T20:00:00Z","due_date":"2025-12-15","cancelled":null,"archived":null,"archive_date":"2025-12-30","award_number":null,"awardee_name":null,"amount":null,"link_sam":"https://sam.gov/workspace/contract/opp/cb3493794b044584a41f1d332e80dfd0/view","enriched":false,"history":[]}],"latest_notice_id":"cb3493794b044584a41f1d332e80dfd0","first_type":"k","notices":[{"dates":{"posted":"2025-07-24","response_deadline":{"raw":"2025-08-15T14:00:00-07:00","utc":"2025-08-15T21:00:00Z","date":"2025-08-15","time":"14:00:00","utc_offset_seconds":-25200}},"links":{"sam":"https://sam.gov/workspace/contract/opp/eb08aee2ad784eeda66fd2f783222610/view"},"naics":{"codes":["334418"],"primary":"334418"},"title":"Multiple Award PCB Fab and Assembly BPAs 2026-2030","agency":{"office":{"code":"HQ0727","name":"DEFENSE MICROELECTRONICS ACTIVITY"},"subtier":{"code":"9771","name":"DEFENSE MICROELECTRONICS ACTIVITY (DMEA)"},"department":{"code":"097","name":"DEPT OF DEFENSE"},"office_address":{"zip":"956522100","city":"MCCLELLAN","state":"CA","country":"USA"},"organization_type":"OFFICE"},"status":{"active":false,"archive_date":"2025-08-30","archive_type":"auto15"},"contacts":[{"name":"RYAN C TUNG","role":"primary","email":"RYAN.C.TUNG.CIV@MAIL.MIL"}],"base_type":{"code":"k","label":"Combined Synopsis/Solicitation"},"notice_id":"eb08aee2ad784eeda66fd2f783222610","set_aside":{"code":"SBA","label":"Total Small Business Set-Aside (FAR 19.5)"},"provenance":{"extract":{"url":"https://s3.amazonaws.com/falextracts/Contract%20Opportunities/Archived%20Data/FY2025_archived_opportunities.csv","etag":"\"d47226e3d2c6545974b252e103f82b34-139\"","fetched_at":"2026-09-16T17:45:50.850439Z","row_sha256":"93a12ec2e3a20a2b37ad0b59bee89b289662e52dc803ba942cc5bca9815d6c05","last_modified":"2026-09-13T14:49:20Z"},"updated_at":"2026-09-16T17:45:50.850439Z","first_seen_at":"2026-09-16T17:45:50.850439Z"},"description":{"text":"DMEA's mission includes developing electronics solutions that solve DOD obsolescence issues and/or provides state of the art SatCom solutions to DOD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DOD operational environments. DMEA intends to competitively issue multiple BPA agreements to all qualifying offerors, in accordance with FAR 13.106-1(a)(2)(iv). The purpose of this solicitation to is to competitively establish a pool of qualified BPA holders in order to rapidly obtain electronics products from industry and commercial PCB Fabrication and/or Assembly companies; specifically those produced by PCB Fabrication and PCB Assembly processes. Maximum ordering ceiling for each BPA holder is ($7.5million / divided by # of qualified offeror.) No individual PCB orders will be awarded at this time, this Combined Synopsis/Solicitation is to competitively establish BPA agreeements with qualified vendors. Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, proposal instructions and evaluation criteria, and DRAFT BPA Agreement language. Proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 2:00pm (Pacific), Friday, 15 August 2025.","origin":"extract"},"notice_type":{"code":"k","label":"Combined Synopsis/Solicitation"},"schema_version":1,"solicitation_number":"HQ072725QRT04","place_of_performance":{"country":{"code":"USA"}},"product_service_code":"5998"},{"dates":{"posted":"2025-07-25","response_deadline":{"raw":"2025-08-15T14:00:00-07:00","utc":"2025-08-15T21:00:00Z","date":"2025-08-15","time":"14:00:00","utc_offset_seconds":-25200}},"links":{"sam":"https://sam.gov/workspace/contract/opp/74b161340dd349269ce67689079e66aa/view"},"naics":{"codes":["334418"],"primary":"334418"},"title":"Multiple Award PCB Fab and Assembly BPAs 2026-2030","agency":{"office":{"code":"HQ0727","name":"DEFENSE MICROELECTRONICS ACTIVITY"},"subtier":{"code":"9771","name":"DEFENSE MICROELECTRONICS ACTIVITY (DMEA)"},"department":{"code":"097","name":"DEPT OF DEFENSE"},"office_address":{"zip":"956522100","city":"MCCLELLAN","state":"CA","country":"USA"},"organization_type":"OFFICE"},"status":{"active":false,"archive_date":"2025-08-30","archive_type":"auto15"},"contacts":[{"name":"RYAN C TUNG","role":"primary","email":"RYAN.C.TUNG.CIV@MAIL.MIL"}],"base_type":{"code":"k","label":"Combined Synopsis/Solicitation"},"notice_id":"74b161340dd349269ce67689079e66aa","set_aside":{"code":"SBA","label":"Total Small Business Set-Aside (FAR 19.5)"},"provenance":{"extract":{"url":"https://s3.amazonaws.com/falextracts/Contract%20Opportunities/Archived%20Data/FY2025_archived_opportunities.csv","etag":"\"d47226e3d2c6545974b252e103f82b34-139\"","fetched_at":"2026-09-16T17:45:50.850439Z","row_sha256":"e72852cd8408ac70ef0afdf4010708dba9f037be9a0c45ae141d56390bc0752b","last_modified":"2026-09-13T14:49:20Z"},"updated_at":"2026-09-16T17:45:50.850439Z","first_seen_at":"2026-09-16T17:45:50.850439Z"},"description":{"text":"Re-attached PWS document that did not load previously. DMEA's mission includes developing electronics solutions that solve DOD obsolescence issues and/or provides state of the art SatCom solutions to DOD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DOD operational environments. DMEA intends to competitively issue multiple BPA agreements to all qualifying offerors, in accordance with FAR 13.106-1(a)(2)(iv). The purpose of this solicitation to is to competitively establish a pool of qualified BPA holders in order to rapidly obtain electronics products from industry and commercial PCB Fabrication and/or Assembly companies; specifically those produced by PCB Fabrication and PCB Assembly processes. Maximum ordering ceiling for each BPA holder is ($7.5million / divided by # of qualified offeror.) No individual PCB orders will be awarded at this time, this Combined Synopsis/Solicitation is to competitively establish BPA agreeements with qualified vendors. Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, proposal instructions and evaluation criteria, and DRAFT BPA Agreement language. Proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 2:00pm (Pacific), Friday, 15 August 2025.","origin":"extract"},"notice_type":{"code":"k","label":"Combined Synopsis/Solicitation"},"schema_version":1,"solicitation_number":"HQ072725QRT04","place_of_performance":{"country":{"code":"USA"}},"product_service_code":"5998"},{"dates":{"posted":"2025-07-29","response_deadline":{"raw":"2025-08-15T14:00:00-07:00","utc":"2025-08-15T21:00:00Z","date":"2025-08-15","time":"14:00:00","utc_offset_seconds":-25200}},"links":{"sam":"https://sam.gov/workspace/contract/opp/1ab0234629644a23a5776bf22eaa3fb0/view"},"naics":{"codes":["334418"],"primary":"334418"},"title":"Multiple Award PCB Fab and Assembly BPAs 2026-2030","agency":{"office":{"code":"HQ0727","name":"DEFENSE MICROELECTRONICS ACTIVITY"},"subtier":{"code":"9771","name":"DEFENSE MICROELECTRONICS ACTIVITY (DMEA)"},"department":{"code":"097","name":"DEPT OF DEFENSE"},"office_address":{"zip":"956522100","city":"MCCLELLAN","state":"CA","country":"USA"},"organization_type":"OFFICE"},"status":{"active":false,"archive_date":"2025-08-30","archive_type":"auto15"},"contacts":[{"name":"RYAN C TUNG","role":"primary","email":"RYAN.C.TUNG.CIV@MAIL.MIL"}],"base_type":{"code":"k","label":"Combined Synopsis/Solicitation"},"notice_id":"1ab0234629644a23a5776bf22eaa3fb0","set_aside":{"code":"SBA","label":"Total Small Business Set-Aside (FAR 19.5)"},"provenance":{"extract":{"url":"https://s3.amazonaws.com/falextracts/Contract%20Opportunities/Archived%20Data/FY2025_archived_opportunities.csv","etag":"\"d47226e3d2c6545974b252e103f82b34-139\"","fetched_at":"2026-09-16T17:45:50.850439Z","row_sha256":"581bd5b68135063140b6ec3d986511e62ea1d4f1ce00f88fd2db1510bed54c0a","last_modified":"2026-09-13T14:49:20Z"},"updated_at":"2026-09-16T17:45:50.850439Z","first_seen_at":"2026-09-16T17:45:50.850439Z"},"description":{"text":"Re-attached PWS document that did not load previously. DMEA's mission includes developing electronics solutions that solve DOD obsolescence issues and/or provides state of the art SatCom solutions to DOD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DOD operational environments. DMEA intends to competitively issue multiple BPA agreements to all qualifying offerors, in accordance with FAR 13.106-1(a)(2)(iv). The purpose of this solicitation to is to competitively establish a pool of qualified BPA holders in order to rapidly obtain electronics products from industry and commercial PCB Fabrication and/or Assembly companies; specifically those produced by PCB Fabrication and PCB Assembly processes. Maximum ordering ceiling for each BPA holder is ($7.5million / divided by # of qualified offeror.) No individual PCB orders will be awarded at this time, this Combined Synopsis/Solicitation is to competitively establish BPA agreeements with qualified vendors. Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, proposal instructions and evaluation criteria, and DRAFT BPA Agreement language. Proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 2:00pm (Pacific), Friday, 15 August 2025.","origin":"extract"},"notice_type":{"code":"k","label":"Combined Synopsis/Solicitation"},"schema_version":1,"solicitation_number":"HQ072725QRT04","place_of_performance":{"country":{"code":"USA"}},"product_service_code":"5998"},{"dates":{"posted":"2025-08-15","response_deadline":{"raw":"2025-08-18T14:00:00-07:00","utc":"2025-08-18T21:00:00Z","date":"2025-08-18","time":"14:00:00","utc_offset_seconds":-25200}},"links":{"sam":"https://sam.gov/workspace/contract/opp/af066fbd52ee421c88d8842e21811234/view"},"naics":{"codes":["334418"],"primary":"334418"},"title":"Multiple Award PCB Fab and Assembly BPAs 2026-2030","agency":{"office":{"code":"HQ0727","name":"DEFENSE MICROELECTRONICS ACTIVITY"},"subtier":{"code":"9771","name":"DEFENSE MICROELECTRONICS ACTIVITY (DMEA)"},"department":{"code":"097","name":"DEPT OF DEFENSE"},"office_address":{"zip":"956522100","city":"MCCLELLAN","state":"CA","country":"USA"},"organization_type":"OFFICE"},"status":{"active":false,"archive_date":"2025-09-02","archive_type":"auto15"},"contacts":[{"name":"RYAN C TUNG","role":"primary","email":"RYAN.C.TUNG.CIV@MAIL.MIL"}],"base_type":{"code":"k","label":"Combined Synopsis/Solicitation"},"notice_id":"af066fbd52ee421c88d8842e21811234","set_aside":{"code":"SBA","label":"Total Small Business Set-Aside (FAR 19.5)"},"provenance":{"extract":{"url":"https://s3.amazonaws.com/falextracts/Contract%20Opportunities/Archived%20Data/FY2025_archived_opportunities.csv","etag":"\"d47226e3d2c6545974b252e103f82b34-139\"","fetched_at":"2026-09-16T17:45:50.850439Z","row_sha256":"fd5c3f8b5fa6d08dbee2de16b5739f5de1d36b9ad7ea6925f451dd6cd1826bf3","last_modified":"2026-09-13T14:49:20Z"},"updated_at":"2026-09-16T17:45:50.850439Z","first_seen_at":"2026-09-16T17:45:50.850439Z"},"description":{"text":"Re-attached PWS document that did not load previously. Extended due date to Monday 18 Aug 2025. DMEA's mission includes developing electronics solutions that solve DOD obsolescence issues and/or provides state of the art SatCom solutions to DOD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DOD operational environments. DMEA intends to competitively issue multiple BPA agreements to all qualifying offerors, in accordance with FAR 13.106-1(a)(2)(iv). The purpose of this solicitation to is to competitively establish a pool of qualified BPA holders in order to rapidly obtain electronics products from industry and commercial PCB Fabrication and/or Assembly companies; specifically those produced by PCB Fabrication and PCB Assembly processes. Maximum ordering ceiling for each BPA holder is ($7.5million / divided by # of qualified offeror.) No individual PCB orders will be awarded at this time, this Combined Synopsis/Solicitation is to competitively establish BPA agreeements with qualified vendors. Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, proposal instructions and evaluation criteria, and DRAFT BPA Agreement language. Proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 2:00pm (Pacific), Friday, 15 August 2025.","origin":"extract"},"notice_type":{"code":"k","label":"Combined Synopsis/Solicitation"},"schema_version":1,"solicitation_number":"HQ072725QRT04","place_of_performance":{"country":{"code":"USA"}},"product_service_code":"5998"},{"dates":{"posted":"2025-12-01","response_deadline":{"raw":"2025-12-15T12:00:00-08:00","utc":"2025-12-15T20:00:00Z","date":"2025-12-15","time":"12:00:00","utc_offset_seconds":-28800}},"links":{"sam":"https://sam.gov/workspace/contract/opp/85968c20af7d4cd3b715b531c42daa71/view"},"naics":{"codes":["334418"],"primary":"334418"},"title":"Multiple Award PCB Fab and Assembly BPAs 2026-2030","agency":{"office":{"code":"HQ0727","name":"DEFENSE MICROELECTRONICS ACTIVITY"},"subtier":{"code":"9771","name":"DEFENSE MICROELECTRONICS ACTIVITY (DMEA)"},"department":{"code":"097","name":"DEPT OF DEFENSE"},"office_address":{"zip":"956522100","city":"MCCLELLAN","state":"CA","country":"USA"},"organization_type":"OFFICE"},"status":{"active":false,"archive_date":"2025-12-30","archive_type":"auto15"},"contacts":[{"name":"RYAN C TUNG","role":"primary","email":"RYAN.C.TUNG.CIV@MAIL.MIL"}],"base_type":{"code":"k","label":"Combined Synopsis/Solicitation"},"notice_id":"85968c20af7d4cd3b715b531c42daa71","set_aside":{"code":"SBA","label":"Total Small Business Set-Aside (FAR 19.5)"},"provenance":{"extract":{"url":"https://s3.amazonaws.com/falextracts/Contract%20Opportunities/Archived%20Data/FY2026_archived_opportunities.csv","etag":"\"d9374b90a938e9923d910594731b7b57-106\"","fetched_at":"2026-09-16T17:48:36.003679Z","row_sha256":"05e76bc5437a70e82d3cb1dd08e7412041241271d84aef96c1aa286032fe87a7","last_modified":"2026-09-13T14:50:39Z"},"updated_at":"2026-09-16T17:48:36.003679Z","first_seen_at":"2026-09-16T17:48:36.003679Z"},"description":{"text":"Re-solicitation of HQ072725QRT04 DMEA's mission includes developing electronics solutions that solve DOD obsolescence issues and/or provides state of the art SatCom solutions to DOD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DOD operational environments. DMEA intends to competitively issue six BPA agreements to offerors based on three factors in the Proposal Instructions and Evaluation Criteria. DMEA anticipate fulfilling orders of Sixty (60) GrimWing units and Sixty (60) DireWing units using the BPAs. Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, and the proposal instructions and evaluation criteria. Phase I proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 12:00pm (Pacific), Monday, 15 December 2025.","origin":"extract"},"notice_type":{"code":"k","label":"Combined Synopsis/Solicitation"},"schema_version":1,"solicitation_number":"HQ072725QRT04","place_of_performance":{"country":{"code":"USA"}},"product_service_code":"5998"},{"dates":{"posted":"2025-12-01","response_deadline":{"raw":"2025-12-15T12:00:00-08:00","utc":"2025-12-15T20:00:00Z","date":"2025-12-15","time":"12:00:00","utc_offset_seconds":-28800}},"links":{"sam":"https://sam.gov/workspace/contract/opp/cb3493794b044584a41f1d332e80dfd0/view"},"naics":{"codes":["334418"],"primary":"334418"},"title":"Multiple Award PCB Fab and Assembly BPAs 2026-2030","agency":{"office":{"code":"HQ0727","name":"DEFENSE MICROELECTRONICS ACTIVITY"},"subtier":{"code":"9771","name":"DEFENSE MICROELECTRONICS ACTIVITY (DMEA)"},"department":{"code":"097","name":"DEPT OF DEFENSE"},"office_address":{"zip":"956522100","city":"MCCLELLAN","state":"CA","country":"USA"},"organization_type":"OFFICE"},"status":{"active":false,"archive_date":"2025-12-30","archive_type":"auto15"},"contacts":[{"name":"RYAN C TUNG","role":"primary","email":"RYAN.C.TUNG.CIV@MAIL.MIL"}],"base_type":{"code":"k","label":"Combined Synopsis/Solicitation"},"notice_id":"cb3493794b044584a41f1d332e80dfd0","set_aside":{"code":"SBA","label":"Total Small Business Set-Aside (FAR 19.5)"},"provenance":{"extract":{"url":"https://s3.amazonaws.com/falextracts/Contract%20Opportunities/Archived%20Data/FY2026_archived_opportunities.csv","etag":"\"d9374b90a938e9923d910594731b7b57-106\"","fetched_at":"2026-09-16T17:48:36.003679Z","row_sha256":"add182a8a0b54f2c877b4fc7b8cbf4e04e6aa3c735f5b91167aec9962a3ead2b","last_modified":"2026-09-13T14:50:39Z"},"updated_at":"2026-09-16T17:48:36.003679Z","first_seen_at":"2026-09-16T17:48:36.003679Z"},"description":{"text":"Re-attached PWS document that did not load previously. Extended due date to Monday 18 Aug 2025. DMEA's mission includes developing electronics solutions that solve DOD obsolescence issues and/or provides state of the art SatCom solutions to DOD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DOD operational environments. DMEA intends to competitively issue multiple BPA agreements to all qualifying offerors, in accordance with FAR 13.106-1(a)(2)(iv). The purpose of this solicitation to is to competitively establish a pool of qualified BPA holders in order to rapidly obtain electronics products from industry and commercial PCB Fabrication and/or Assembly companies; specifically those produced by PCB Fabrication and PCB Assembly processes. Maximum ordering ceiling for each BPA holder is ($7.5million / divided by # of qualified offeror.) No individual PCB orders will be awarded at this time, this Combined Synopsis/Solicitation is to competitively establish BPA agreeements with qualified vendors. Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, proposal instructions and evaluation criteria, and DRAFT BPA Agreement language. Proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 2:00pm (Pacific), Friday, 15 August 2025.","origin":"extract"},"notice_type":{"code":"k","label":"Combined Synopsis/Solicitation"},"schema_version":1,"solicitation_number":"HQ072725QRT04","place_of_performance":{"country":{"code":"USA"}},"product_service_code":"5998"}],"due_at":"2025-12-15T20:00:00Z","due_date":"2025-12-15","closes_at":"2025-12-15T20:00:00Z","awardable":false,"dept_key":"d-097","dept_name":"DEPT OF DEFENSE","sub_key":"s-9771","sub_name":"DEFENSE MICROELECTRONICS ACTIVITY (DMEA)","office_key":"o-HQ0727","office_name":"DEFENSE MICROELECTRONICS ACTIVITY","state":null,"county":null,"county_name":null,"city":null,"city_name":null,"country":"USA","winner_key":"ECTJB433GHK9","amount":null,"linked_awards":84,"cancelled":false,"archived":false,"updated_at":"2026-09-16T21:18:12.857524Z","principal_notice_id":"cb3493794b044584a41f1d332e80dfd0","description":{"text":"Re-attached PWS document that did not load previously. Extended due date to Monday 18 Aug 2025. DMEA's mission includes developing electronics solutions that solve DOD obsolescence issues and/or provides state of the art SatCom solutions to DOD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DOD operational environments. DMEA intends to competitively issue multiple BPA agreements to all qualifying offerors, in accordance with FAR 13.106-1(a)(2)(iv). The purpose of this solicitation to is to competitively establish a pool of qualified BPA holders in order to rapidly obtain electronics products from industry and commercial PCB Fabrication and/or Assembly companies; specifically those produced by PCB Fabrication and PCB Assembly processes. Maximum ordering ceiling for each BPA holder is ($7.5million / divided by # of qualified offeror.) No individual PCB orders will be awarded at this time, this Combined Synopsis/Solicitation is to competitively establish BPA agreeements with qualified vendors. Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, proposal instructions and evaluation criteria, and DRAFT BPA Agreement language. Proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 2:00pm (Pacific), Friday, 15 August 2025.","html":null,"origin":"extract"},"contacts":[{"name":"RYAN C TUNG","role":"primary","email":"RYAN.C.TUNG.CIV@MAIL.MIL"}],"place_of_performance":{"country":{"code":"USA"}},"office_address":{"zip":"956522100","city":"MCCLELLAN","state":"CA","country":"USA"},"naics_codes":["334418"],"award":null,"attachments":[],"awards":[{"award_key":"CONT_AWD_HQ072726FE039_9700_HQ072726AE005_9700","permalink":"https://www.usaspending.gov/award/CONT_AWD_HQ072726FE039_9700_HQ072726AE005_9700/","piid":"HQ072726FE039","parent_piid":"HQ072726AE005","award_type":"BPA CALL","vendor_key":"D85RV52AMFV5","recipient_name":"OUT OF THE BOX MANUFACTURING LLC","recipient_uei":"D85RV52AMFV5","recipient_cage":"7VBJ5","recipient_city":"RENTON","recipient_state":"WA","sub_name":"Defense Microelectronics Activity","office_name":"DEFENSE MICROELECTRONICS ACTIVITY","office_key":"o-HQ0727","first_action_date":"2026-03-05","last_action_date":"2026-03-05","actions":1,"obligated":"13331.20","current_total_value":"13331.20","potential_total_value":"13331.20","naics":"334418","psc":"5998","extent_competed":"COMPETED UNDER SAP","set_aside":"SMALL BUSINESS SET ASIDE - TOTAL","offers_received":10,"description":"PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.","method":"solicitation","confidence":"high","evidence":["solicitation number HQ072725QRT04 equals the FPDS solicitation identifier","same awarding office HQ0727"],"opportunity_key":null,"opportunity_title":null},{"award_key":"CONT_AWD_HQ072726FE040_9700_HQ072726AE002_9700","permalink":"https://www.usaspending.gov/award/CONT_AWD_HQ072726FE040_9700_HQ072726AE002_9700/","piid":"HQ072726FE040","parent_piid":"HQ072726AE002","award_type":"BPA CALL","vendor_key":"WQNJUQYA25F9","recipient_name":"AMERICAN COMPUTER DEVELOPMENT, INCORPORATED","recipient_uei":"WQNJUQYA25F9","recipient_cage":"3A2K5","recipient_city":"FREDERICK","recipient_state":"MD","sub_name":"Defense Microelectronics Activity","office_name":"DEFENSE MICROELECTRONICS ACTIVITY","office_key":"o-HQ0727","first_action_date":"2026-03-05","last_action_date":"2026-03-05","actions":1,"obligated":"12931.60","current_total_value":"12931.60","potential_total_value":"12931.60","naics":"334418","psc":"5998","extent_competed":"COMPETED UNDER SAP","set_aside":"SMALL BUSINESS SET ASIDE - TOTAL","offers_received":10,"description":"PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.","method":"solicitation","confidence":"high","evidence":["solicitation number HQ072725QRT04 equals the FPDS solicitation identifier","same awarding office HQ0727"],"opportunity_key":null,"opportunity_title":null},{"award_key":"CONT_AWD_HQ072726FE041_9700_HQ072726AE004_9700","permalink":"https://www.usaspending.gov/award/CONT_AWD_HQ072726FE041_9700_HQ072726AE004_9700/","piid":"HQ072726FE041","parent_piid":"HQ072726AE004","award_type":"BPA CALL","vendor_key":"MY7VDCKUR534","recipient_name":"CIRCUIT SPRING, LLC","recipient_uei":"MY7VDCKUR534","recipient_cage":"13RC4","recipient_city":"LENEXA","recipient_state":"KS","sub_name":"Defense Microelectronics Activity","office_name":"DEFENSE MICROELECTRONICS ACTIVITY","office_key":"o-HQ0727","first_action_date":"2026-03-06","last_action_date":"2026-03-06","actions":1,"obligated":"10329.00","current_total_value":"10329.00","potential_total_value":"10329.00","naics":"334418","psc":"5998","extent_competed":"COMPETED UNDER SAP","set_aside":"SMALL BUSINESS SET ASIDE - TOTAL","offers_received":10,"description":"PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.","method":"solicitation","confidence":"high","evidence":["solicitation number HQ072725QRT04 equals the FPDS solicitation identifier","same awarding office HQ0727"],"opportunity_key":null,"opportunity_title":null},{"award_key":"CONT_AWD_HQ072726FE042_9700_HQ072726AE003_9700","permalink":"https://www.usaspending.gov/award/CONT_AWD_HQ072726FE042_9700_HQ072726AE003_9700/","piid":"HQ072726FE042","parent_piid":"HQ072726AE003","award_type":"BPA CALL","vendor_key":"UJZCPVZMJCL4","recipient_name":"PRINTED CIRCUITS CORP.","recipient_uei":"UJZCPVZMJCL4","recipient_cage":"1WXP2","recipient_city":"LILBURN","recipient_state":"GA","sub_name":"Defense Microelectronics Activity","office_name":"DEFENSE MICROELECTRONICS ACTIVITY","office_key":"o-HQ0727","first_action_date":"2026-03-06","last_action_date":"2026-03-06","actions":1,"obligated":"11160.00","current_total_value":"11160.00","potential_total_value":"11160.00","naics":"334418","psc":"5998","extent_competed":"COMPETED UNDER SAP","set_aside":"SMALL BUSINESS SET ASIDE - TOTAL","offers_received":10,"description":"PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.","method":"solicitation","confidence":"high","evidence":["solicitation number HQ072725QRT04 equals the FPDS solicitation identifier","same awarding office HQ0727"],"opportunity_key":null,"opportunity_title":null},{"award_key":"CONT_AWD_HQ072726FE043_9700_HQ072726AE006_9700","permalink":"https://www.usaspending.gov/award/CONT_AWD_HQ072726FE043_9700_HQ072726AE006_9700/","piid":"HQ072726FE043","parent_piid":"HQ072726AE006","award_type":"BPA CALL","vendor_key":"PJHANNALLLW6","recipient_name":"TRYLENE, INC.","recipient_uei":"PJHANNALLLW6","recipient_cage":"7M6V9","recipient_city":"HOUSTON","recipient_state":"TX","sub_name":"Defense Microelectronics Activity","office_name":"DEFENSE MICROELECTRONICS ACTIVITY","office_key":"o-HQ0727","first_action_date":"2026-03-06","last_action_date":"2026-03-06","actions":1,"obligated":"12105.00","current_total_value":"12105.00","potential_total_value":"12105.00","naics":"334418","psc":"5998","extent_competed":"COMPETED UNDER SAP","set_aside":"SMALL BUSINESS SET ASIDE - TOTAL","offers_received":10,"description":"PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.","method":"solicitation","confidence":"high","evidence":["solicitation number HQ072725QRT04 equals the FPDS solicitation identifier","same awarding office HQ0727"],"opportunity_key":null,"opportunity_title":null},{"award_key":"CONT_AWD_HQ072726FE045_9700_HQ072726AE007_9700","permalink":"https://www.usaspending.gov/award/CONT_AWD_HQ072726FE045_9700_HQ072726AE007_9700/","piid":"HQ072726FE045","parent_piid":"HQ072726AE007","award_type":"BPA CALL","vendor_key":"G5LHK66N7M25","recipient_name":"UNIFIED BUSINESS TECHNOLOGIES, INC.","recipient_uei":"G5LHK66N7M25","recipient_cage":"3XMH1","recipient_city":"TROY","recipient_state":"MI","sub_name":"Defense Microelectronics Activity","office_name":"DEFENSE MICROELECTRONICS ACTIVITY","office_key":"o-HQ0727","first_action_date":"2026-03-09","last_action_date":"2026-03-09","actions":1,"obligated":"21301.00","current_total_value":"21301.00","potential_total_value":"21301.00","naics":"334418","psc":"5998","extent_competed":"COMPETED UNDER SAP","set_aside":"SMALL BUSINESS SET ASIDE - TOTAL","offers_received":10,"description":"PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.","method":"solicitation","confidence":"high","evidence":["solicitation number HQ072725QRT04 equals the FPDS solicitation identifier","same awarding office HQ0727"],"opportunity_key":null,"opportunity_title":null},{"award_key":"CONT_AWD_HQ072726FE046_9700_HQ072726AE001_9700","permalink":"https://www.usaspending.gov/award/CONT_AWD_HQ072726FE046_9700_HQ072726AE001_9700/","piid":"HQ072726FE046","parent_piid":"HQ072726AE001","award_type":"BPA CALL","vendor_key":"ECTJB433GHK9","recipient_name":"SIERRA CIRCUITS, INC.","recipient_uei":"ECTJB433GHK9","recipient_cage":"0ZHS4","recipient_city":"SUNNYVALE","recipient_state":"CA","sub_name":"Defense Microelectronics Activity","office_name":"DEFENSE MICROELECTRONICS ACTIVITY","office_key":"o-HQ0727","first_action_date":"2026-03-09","last_action_date":"2026-03-09","actions":1,"obligated":"27381.80","current_total_value":"27381.80","potential_total_value":"27381.80","naics":"334418","psc":"5998","extent_competed":"COMPETED UNDER SAP","set_aside":"SMALL BUSINESS SET ASIDE - TOTAL","offers_received":10,"description":"PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.","method":"solicitation","confidence":"high","evidence":["solicitation number HQ072725QRT04 equals the FPDS solicitation identifier","same awarding office HQ0727"],"opportunity_key":null,"opportunity_title":null},{"award_key":"CONT_IDV_HQ072726AE001_9700","permalink":"https://www.usaspending.gov/award/CONT_IDV_HQ072726AE001_9700/","piid":"HQ072726AE001","parent_piid":null,"award_type":null,"vendor_key":"ECTJB433GHK9","recipient_name":"SIERRA CIRCUITS, INC.","recipient_uei":"ECTJB433GHK9","recipient_cage":"0ZHS4","recipient_city":"SUNNYVALE","recipient_state":"CA","sub_name":"Defense Microelectronics Activity","office_name":"DEFENSE MICROELECTRONICS ACTIVITY","office_key":"o-HQ0727","first_action_date":"2026-02-23","last_action_date":"2026-05-11","actions":2,"obligated":"0","current_total_value":null,"potential_total_value":"1285714.00","naics":"334418","psc":"5998","extent_competed":null,"set_aside":null,"offers_received":null,"description":"PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.","method":"solicitation","confidence":"high","evidence":["solicitation number HQ072725QRT04 equals the FPDS solicitation identifier","same awarding office HQ0727"],"opportunity_key":null,"opportunity_title":null},{"award_key":"CONT_IDV_HQ072726AE002_9700","permalink":"https://www.usaspending.gov/award/CONT_IDV_HQ072726AE002_9700/","piid":"HQ072726AE002","parent_piid":null,"award_type":null,"vendor_key":"WQNJUQYA25F9","recipient_name":"AMERICAN COMPUTER DEVELOPMENT, INCORPORATED","recipient_uei":"WQNJUQYA25F9","recipient_cage":"3A2K5","recipient_city":"FREDERICK","recipient_state":"MD","sub_name":"Defense Microelectronics Activity","office_name":"DEFENSE MICROELECTRONICS ACTIVITY","office_key":"o-HQ0727","first_action_date":"2026-02-23","last_action_date":"2026-05-12","actions":2,"obligated":"0","current_total_value":null,"potential_total_value":"1285714.00","naics":"334418","psc":"5998","extent_competed":null,"set_aside":null,"offers_received":null,"description":"PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.","method":"solicitation","confidence":"high","evidence":["solicitation number HQ072725QRT04 equals the FPDS solicitation identifier","same awarding office HQ0727"],"opportunity_key":null,"opportunity_title":null},{"award_key":"CONT_IDV_HQ072726AE003_9700","permalink":"https://www.usaspending.gov/award/CONT_IDV_HQ072726AE003_9700/","piid":"HQ072726AE003","parent_piid":null,"award_type":null,"vendor_key":"UJZCPVZMJCL4","recipient_name":"PRINTED CIRCUITS CORP.","recipient_uei":"UJZCPVZMJCL4","recipient_cage":"1WXP2","recipient_city":"LILBURN","recipient_state":"GA","sub_name":"Defense Microelectronics Activity","office_name":"DEFENSE MICROELECTRONICS ACTIVITY","office_key":"o-HQ0727","first_action_date":"2026-02-23","last_action_date":"2026-05-21","actions":2,"obligated":"0","current_total_value":null,"potential_total_value":"1285714.00","naics":"334418","psc":"5998","extent_competed":null,"set_aside":null,"offers_received":null,"description":"PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.","method":"solicitation","confidence":"high","evidence":["solicitation number HQ072725QRT04 equals the FPDS solicitation identifier","same awarding office HQ0727"],"opportunity_key":null,"opportunity_title":null},{"award_key":"CONT_IDV_HQ072726AE004_9700","permalink":"https://www.usaspending.gov/award/CONT_IDV_HQ072726AE004_9700/","piid":"HQ072726AE004","parent_piid":null,"award_type":null,"vendor_key":"MY7VDCKUR534","recipient_name":"CIRCUIT SPRING, LLC","recipient_uei":"MY7VDCKUR534","recipient_cage":"13RC4","recipient_city":"LENEXA","recipient_state":"KS","sub_name":"Defense Microelectronics Activity","office_name":"DEFENSE MICROELECTRONICS ACTIVITY","office_key":"o-HQ0727","first_action_date":"2026-02-23","last_action_date":"2026-05-13","actions":2,"obligated":"0","current_total_value":null,"potential_total_value":"1285714.00","naics":"334418","psc":"5998","extent_competed":null,"set_aside":null,"offers_received":null,"description":"PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.","method":"solicitation","confidence":"high","evidence":["solicitation number HQ072725QRT04 equals the FPDS solicitation identifier","same awarding office HQ0727"],"opportunity_key":null,"opportunity_title":null},{"award_key":"CONT_IDV_HQ072726AE005_9700","permalink":"https://www.usaspending.gov/award/CONT_IDV_HQ072726AE005_9700/","piid":"HQ072726AE005","parent_piid":null,"award_type":null,"vendor_key":"D85RV52AMFV5","recipient_name":"OUT OF THE BOX MANUFACTURING LLC","recipient_uei":"D85RV52AMFV5","recipient_cage":"7VBJ5","recipient_city":"RENTON","recipient_state":"WA","sub_name":"Defense Microelectronics Activity","office_name":"DEFENSE MICROELECTRONICS ACTIVITY","office_key":"o-HQ0727","first_action_date":"2026-02-23","last_action_date":"2026-05-21","actions":2,"obligated":"0","current_total_value":null,"potential_total_value":"1285714.00","naics":"334418","psc":"5998","extent_competed":null,"set_aside":null,"offers_received":null,"description":"PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.","method":"solicitation","confidence":"high","evidence":["solicitation number HQ072725QRT04 equals the FPDS solicitation identifier","same awarding office HQ0727"],"opportunity_key":null,"opportunity_title":null},{"award_key":"CONT_IDV_HQ072726AE006_9700","permalink":"https://www.usaspending.gov/award/CONT_IDV_HQ072726AE006_9700/","piid":"HQ072726AE006","parent_piid":null,"award_type":null,"vendor_key":"PJHANNALLLW6","recipient_name":"TRYLENE, INC.","recipient_uei":"PJHANNALLLW6","recipient_cage":"7M6V9","recipient_city":"HOUSTON","recipient_state":"TX","sub_name":"Defense Microelectronics Activity","office_name":"DEFENSE MICROELECTRONICS ACTIVITY","office_key":"o-HQ0727","first_action_date":"2026-02-23","last_action_date":"2026-05-13","actions":2,"obligated":"0","current_total_value":null,"potential_total_value":"1285714.00","naics":"334418","psc":"5998","extent_competed":null,"set_aside":null,"offers_received":null,"description":"PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.","method":"solicitation","confidence":"high","evidence":["solicitation number HQ072725QRT04 equals the FPDS solicitation identifier","same awarding office HQ0727"],"opportunity_key":null,"opportunity_title":null},{"award_key":"CONT_IDV_HQ072726AE007_9700","permalink":"https://www.usaspending.gov/award/CONT_IDV_HQ072726AE007_9700/","piid":"HQ072726AE007","parent_piid":null,"award_type":null,"vendor_key":"G5LHK66N7M25","recipient_name":"UNIFIED BUSINESS TECHNOLOGIES, INC.","recipient_uei":"G5LHK66N7M25","recipient_cage":"3XMH1","recipient_city":"TROY","recipient_state":"MI","sub_name":"Defense Microelectronics Activity","office_name":"DEFENSE MICROELECTRONICS ACTIVITY","office_key":"o-HQ0727","first_action_date":"2026-02-23","last_action_date":"2026-05-14","actions":2,"obligated":"0","current_total_value":null,"potential_total_value":"1285714.00","naics":"334418","psc":"5998","extent_competed":null,"set_aside":null,"offers_received":null,"description":"PCB FABRICATION AND ASSEMBLY OF MICROELECTRONIC COMPONENTS TO PROVIDE FLEXIBLE, FULL-SPECTRUM MICROELECTRONICS SOLUTIONS TO MEET DEPARTMENT OF DEFENSE NEEDS.","method":"solicitation","confidence":"high","evidence":["solicitation number HQ072725QRT04 equals the FPDS solicitation identifier","same awarding office HQ0727"],"opportunity_key":null,"opportunity_title":null}],"related":[{"key":"HQ072726MQ01","latest_notice_id":"b5e749bc811f4060b81d78e67afc847e","title":"FY26 Keysight Software Maintenance","solicitation_number":"HQ072726MQ01","notice_type":"k","first_type":"k","first_posted":"2026-02-23","last_posted":"2026-02-23","notices":2,"due_at":"2028-02-26T20:00:00Z","due_date":"2028-02-26","closes_at":"2028-02-26T20:00:00Z","awardable":true,"open":true,"dept_key":"d-097","dept_name":"DEPT OF DEFENSE","sub_key":"s-9771","sub_name":"DEFENSE MICROELECTRONICS ACTIVITY (DMEA)","office_key":"o-HQ0727","office_name":"DEFENSE MICROELECTRONICS ACTIVITY","naics":"541519","psc":"7A21","set_aside":"8AN","state":"CA","county":"06067","county_name":"Sacramento County","city":null,"city_name":null,"country":"USA","winner":null,"winner_key":null,"amount":null,"linked_awards":0,"cancelled":false,"archived":false,"updated_at":"2026-09-16T21:18:12.857524Z"}]}