# Next-Generation Microelectronics Manufacturing (NGMM) Phase 1 and Phase 2

Canonical: https://abierto.us/opportunities/darpapa2403

- Solicitation number: DARPA-PA-24-03
- Notice type: Presolicitation
- Status: Closed. Deadline was March 5, 2024
- Department: Department of Defense
- Agency: Defense Advanced Research Projects Agency
- Contracting office: Def Advanced Research Projects Agcy (HR0011)
- NAICS: 541715 Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
- Product or service code: AC13 National Defense R&D Services; Department Of Defense - Military; Experimental Development
- First posted: January 12, 2024
- Last posted: January 19, 2024
- SAM.gov: https://sam.gov/workspace/contract/opp/dfdbe8ad7dfe4c27946b2220d64691dc/view

## Description

**Amendment 04:** The purpose of this amendment is to make an administrative correction to Section 2.3.4 and Section 5 to align with the correction to Table 1 via Amendment 03.

**Amendment 03:** The purpose of this Amendment is to update the program schedule, correct Table 1, and add Section 3.4.10 indicating that the Government may elect to conduct site visits for conforming Full Proposal submissions.

**Amendment 02:** The purpose of this Amendment is to incorporate changes to Section 2.3.4 and Section 3.1.

**Amendment 01:** The purpose of this administrative Amendment is to remove the duplicate Figure 2 from Page 9 for clarity. The NGMM program will advance the state of the art in three-dimensional heterogeneously integrated (3DHI) microelectronics through the formation of a domestic open-access prototyping and pilot line capability. This announcement solicits proposals for Phases 1 and 2 of the NGMM program.

Phase 1 will focus on procuring and installing equipment, establishing baseline fabrication processes, developing a 3D assembly design kit (3D-ADK), and design automation and simulation software tailored to 3DHI. Phase 2 will build on Phase 1 to create hardware prototypes, automate processes, and develop emulation capabilities.

The end goal of the program is to establish a self-sustaining 3DHI manufacturing center at an existing facility that is owned and operated by a non-federal entity and accessible to users in academia, government, and industry. Success will be measured by the ability to produce high-performance 3DHI microsystems at reasonable cost, with cycle times supporting fast-paced innovative research.

## Publications

- January 12, 2024: Presolicitation, due March 5, 2024. Notice 0482a3958abb4d1babe4d1b06b47b306. https://sam.gov/workspace/contract/opp/0482a3958abb4d1babe4d1b06b47b306/view
- January 19, 2024: Presolicitation, due March 5, 2024. Notice dfdbe8ad7dfe4c27946b2220d64691dc. https://sam.gov/workspace/contract/opp/dfdbe8ad7dfe4c27946b2220d64691dc/view

## Points of contact

- Dr. Dev Palmer, DARPA-PA-24-03@darpa.mil

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Source: SAM.gov Contract Opportunities bulk extract. Confirm deadlines on SAM.gov before responding. Cite https://abierto.us/opportunities/darpapa2403.